Team from Purdue University named as winner in Phase Two of the SRC/SIA IC Design Challenge
Phase Two Winners
| Team |
Design Title |
University | Faculty Leader | Prize |
| 19 | Chip-to-chip Wireless Data Link using
U-band Transceiver
| Purdue University | Byunghoo Jung | First Place - $25,000 |
| 23 | A Dual-band Millimeter-wave Receiver using SiGe Technology | Texas A&M University | Edgar Sanchez-Sinencio | Second Place - $15,000 |
| 2 | A Tunable Multiband RF MEMS Transceiver Front-end | Carnegie Mellon University | Tamal Mukherjee | Third Place -
$10,000
|
Three university teams have been identified as the winners in Phase II of the Design Challenge. The winners will receive awards of $25K, $15K and $10K for first, second and third place, respectively. Awards will be presented at ISSCC in February.
