TECHCON 2010
CareerConnections is over 200 of the top students in microelectronics-related disciplines gathered for a single event! Rich recruiting ground – for now or later!
CareerConnections follows TechFair on Tuesday afternoon from 5:30 – 7:00 p.m. Resumes for student presenters are collected in a zip file on the SRC website. All TECHCON 2010 attendees interested in students are invited to CareerConnections in Glass Oaks off the Atrium Level.
Students: Bring your resume!
Thanks to the companies operating booths at CareerConnections and also sponsoring other events at TECHCON including dinner for students on Sunday evening. Participating companies include:
- Applied Materials, Inc.
- Freescale Semiconductor, Inc.
- GLOBALFOUNDRIES, Inc.
- IBM Corporation
- Intel Corporation
- Novellus Systems, Inc.
- Raytheon Company
- Texas Instruments Inc.
Conference at a Glance
| Sunday, September 12, 2010 | ||
|---|---|---|
| 5:00 - 9:00 PM | Poster Setup / Student Dinner | Rio Grande A |
| Monday, September 13, 2010 | ||
| 7:00 -8:00 AM | Breakfast | Rio Grande B |
| Sessions 1-4 | ||
| 8:00 - 10:40 AM | Session 1 - Test and Testability | San Marcos |
| Session 2 - Analog, I/O and mm-Wave Circuit Design | Pecos | |
| Session 3 - Nanoengineered Materials | Sabine | |
| Session 4 - Memory and Analog Technologies | San Antonio | |
| 10:40 AM - 12:10 PM | TechFair 1 - Posters for Sessions 1-4 | Rio Grande A |
| 12:10 PM - 1:10 PM | Lunch | Rio Grande B |
| Sessions 5-8 | ||
| 1:10 - 3:50 PM | Session 5 - Verification | San Marcos |
| Session 6 - Multi-Core and Parallel System Design | Pecos | |
| Session 7 - Cu Low k Extendability | Sabine | |
| Session 8 - Patterning Materials and Systems | San Antonio | |
| 3:50 - 5:20 PM | TechFair 2 - Posters for Sessions 5-8 | Rio Grande A |
| 5:30 - 6:30 PM | Special Session: New Frontiers in Nanoscale Devices and Nanofabrication | Ballroom B (Atrium Level) |
| 6:30 - 7:00 PM | Reception | Plaza Foyer |
| 7:00 PM |
Conference Banquet/Presentation of Awards |
Rio Grande B |
| Tuesday, September 14, 2010 | ||
| 7:00 - 8:00 AM | Breakfast | Rio Grande B |
| Sessions 9-12 | ||
| 8:00 - 10:40 AM | Session 9 - Environment, Safety and Health | San Marcos |
| Session 10 A - Digital Circuits and Systems Design & 10 B - 3D Design Techniques and Tools | Pecos | |
| Session 11 - Packaging | Sabine | |
| Session 12 - Si, Ge, and III-V Advanced Technologies | San Marcos | |
| 10:40 AM - 12:10 PM | TechFair 3 - Posters for Sessions 9-12 | Rio Grande A |
| 12:10 - 1:10 PM | Lunch | Rio Grande B |
| Sessions 13-15 | ||
| 1:10 - 3:50 PM | Session 13 - Logic/Physical Design | San Marcos |
| Session 14 - Data Converter Design | Pecos | |
| Session 15 - 3D and Beyond Cu / Low k | Sabine | |
| Session 16 - Nano-Scale and Magnetic Devices | San Antonio | |
| 3:50 - 5:20 PM | TechFair 4 - Posters for Sessions 13 - 16 | Rio Grande A |
| 5:30 - 7:00 PM | CareerConnections | Glass Oaks |
| 7:00 PM | Dinner/Best in Session Awards |
Rio Grande A
|
| Company Contact List for Block Registration | ||
|---|---|---|
| Advanced Micro Devices, Inc | Chuck Moore | |
| Applied Materials, Inc. | John Dukovic | |
| Freescale Semiconductor, Inc. | Marie Burnham | |
| GLOBALFOUNDRIES, Inc. | Dale Edwards | |
| IBM Corporation | David Onsongo | |
| Intel Corporation | Carl Rimby | |
| Mentor Graphics Corporation | Chris Hardy | |
| MICRON Technology, Inc. | Chandra Mouli | |
| MITRE | Registration | |
| Novellus Systems, Inc | Andy Antonelli | |
| Raytheon | John Zolper | |
| Rohm & Haas (Dow Chemical) | Jeffrey Calvert | |
| Texas Instruments Incorporated | Allen Bowling | |
| Tokyo Electron Limited (TEL) | Dorel Toma | |
| United Technologies | Registration | |
This page contains a listing of presenters and thier presentations for sessions 1-16 and a listing of students and posters for the Undergrduate Research Opportunities Poster Sessions.
Session 1 - Test and Testability
| Monday, September 13 - San Marcos | ||||
|---|---|---|---|---|
| 8:00 AM | 1.1 | FCRP | Shreyas Sen Georgia Institute of Technology |
Design of Process and Environment Adaptive Ultra Low Power Wireless Front End Systems |
| 8:15 AM | 1.2 | GRC | Jingbo Duan Iowa State University |
Phase Control of Triangular Stimulus for ADC BIST |
| 8:30 AM | 1.3 | FCRP | Hsiu-Ming Chang Univ. of California/Santa Barbara |
Integrated Calibration and Test for Digitally-Calibrated Analog Designs |
| 8:45 AM | 1.4 | GRC | Changdao Dong Carnegie Mellon University |
Toward a Unified Statistical Analysis Engine of SRAM Yield, Reliability and Testability via Gibbs Sampling |
| 9:00 AM | 1.5 | GRC | Fahad Ahmed Georgia Institute of Technology |
On-Chip Test and Diagnostic System for Caches |
| 9:15 AM | BREAK | |||
| 9:40 AM | 1.6 | GRC | XiaoXiao Wang Univ. of Connecticut |
Low-Cost On-Chip Structures for Measuring NBTI Effects, Variations, Path Delay, and Noise |
| 9:55 AM | 1.7 | GRC | Junxia Ma Univ. of Connecticut |
A Low-Cost Diagnostic Procedure for Parametric Failures Caused by Pattern-Induced Noises |
| 10:10 AM | 1.8 | FCRP | Leyi Yin Texas A&M University |
In-Situ Jitter Test and Diagnosis of Digital PLLs Using Digital Reconfiguration |
| 10:25 AM | 1.9 | GRC | Shayak Lahiri Texas A&M University |
KLPG Test for Microprocessor |
| Poster Only | 1.10 | GRC | Diana Mui Intel Foundation/SRCEA Scholar Stanford University |
QED: Quick Error Detection Tests for Effective Post Silicon Validation |
Session 2 - Analog I/O and mm-Wave Circuit Design
| Monday, September 13 - Pecos | ||||
|---|---|---|---|---|
| 8:00 AM | 2.1 | GRC | ZhengGao Southern Methodist University |
A Monolithic Integrated High-Voltage Linear Amplifier for Ultrasound Medical Applications |
| 8:15 AM | 2.2 | GRC | Hyunsoo Yeom Arizona State University |
Temperature Compensated, High Common Mode Range, Cu-Trace Based Current Shunt Monitor Amplifier |
| 8:30 AM | 2.3 | FCRP | Mudit Bhargava Carnegie Mellon University |
Sense-Amplifier-Based Physically Unclonable Functions |
| 8:45 AM | 2.4 | GRC | Tzu-Chien Hsueh Univ. of California/Los Angeles |
CDMA-Based Crosstalk Cancellation for Chip-to-Chip High-Speed Links with TX Timing Adjustment |
| 9:00 AM | 2.5 | GRC | Suqing Cao Stanford University |
ESD and High-Speed I/O Driver Characterization and Co-Design Methodology |
| 9:15 AM | BREAK | |||
| 9:40 AM | 2.6 | FCRP | Maryam Tabesh Univ. of California/Berkeley |
Analysis of Passive Mixer Performance for mm-Wave Applications |
| 9:55 AM | 2.7 | GRC | Rownak Islam Univ. of Texas/Dallas |
Performance of Planar Transmission Lines for Millimeter-Wave CMOS |
| 10:10 AM | 2.8 | GRC | Shadi Saberi Ghouchani Intel Foundation/SRCEA Fellow Carnegie Mellon University |
Mm-Wave Frequency Generation |
| 10:25 AM | 2.9 | GRC | Richard Pierce Univ. of Texas/Dallas |
Broadband Modified Bowtie Aperture Antenna |
Session 3 - Nanoengineered Materials
| Monday, September 13 - Sabine | ||||
|---|---|---|---|---|
| 8:00 AM | 3.1 | GRC | Cameron Bjelkevig Univ. of North Texas |
Graphene/BN(111) Heterojunctions Grown Directly on Ru(0001) by CVD and ALD |
| 8:15 AM | 3.2 | NRI | Muge Acik Univ. of Texas/Dallas |
New Insights into the Thermal Reduction of Graphene Oxide |
| 8:30 AM | 3.3 | NRI | Adam Pirkle Univ. of Texas/Dallas |
In-situ XPS Studies of ALD Al(2)O(3) on Graphite using TMA/O(3) |
| 8:45 AM | 3.4 | NRI | Byoung-Don Kong North Carolina State University |
Thermal Resistance in Graphene/Substrate Interfaces |
| 9:00 AM | 3.5 | FCRP | Khan M Farhan Shahil Univ. of California/Riverside |
Spectroscopic Raman Nanometrology of the Atomically-Thin Crystalline Bi(2)T(3) and Bi(2)Se(3) Films |
| 9:15 AM | Break | |||
| 9:40 AM | 3.6 | FCRP | Desalegne Teweldebrhan Univ. of California/Riverside |
"Graphene-Like" Exfoliation of Quasi-2D Crystals of Bismuth Telluride: Applications in Thermoelectrics and Topological Insulators |
| 9:55 AM | 3.7 | NRI | Yuri Zuev Columbia University |
Survey of Thermoelectric Properties of Nanoscale Materials |
| 10:10 AM | 3.8 | NRI | Rebecca Thomas North Carolina State U |
Gd Doped Ferromagnetic Transition Metals for Enhancement of Domain Wall Motion |
| 10:25 AM | 3.9 | GRC | Masahiro Hori niversity Waseda University |
Improving Single Dopant Detection Efficiency by Controlling Substrate Bias in Single Ion Implantation Method |
Session 4 - Memory and Analog Technologies
| Monday, September 13 - San Antonio | ||||
|---|---|---|---|---|
| 8:00 AM | 4.1 | GRC | Cheng-Yi Peng Yale University |
A SONOS-Type Memory Stack with High-Quality Tunnel/Blocking Al(2)O(3) Featuring Low-Voltage High-Speed Operation and Outstanding 150 C Retention |
| 8:15 AM | 4.2 | GRC | Kristina Young-Fisher Univ. of Houston |
Enhanced Retention in Complex Oxide RRAM Devices |
| 8:30 AM | 4.3 | GRC | Rabi Ebrahim Univ. of Houston |
Regular and Reversed Polarity EPIR Switching at Low and High Resistance Regimes in Cu(X)O RRAM |
| 8:45 AM | 4.4 | GRC | Srikar Jandhyala Univ. of Texas/Dallas |
Deuterium Diffusion Characteristics through Single and Multi-Layer Oxides as Hydrogen Barriers for FeRAM Applications |
| 9:00 AM | 4.5 | FCRP | Domingo Ferrer Univ. of Texas/Austin |
Shape-Specific FePt Nanomagnets for Spin Torque Memory Devices |
| 9:15 AM | BREAK | |||
| 9:40 AM | 4.6 | GRC | Taehun Lee Univ. of Texas/Dallas |
High Thermal Conductivity SOI Substrates for Mixed-Signal Application |
| 9:55 AM | 4.7 | GRC | Anuj Madan Georgia Institute of Technology |
Understanding and Modeling of Linearity in Silicon-Germanium Heterojunction Bipolar Transistors |
| 10:10 AM | 4.8 | GRC | Shiji Pan Univ. of California/Irvine |
Investigation of CMOS On-Chip-Integrated Antennas at Millimeter Wave Frequencies |
| 10:25 AM | 4.9 | GRC | Stefano Poli Univ. of Bologna |
Numerical and Experimental Investigation of Lateral and Vertical Power MOSFETs for HV Applications |
| Poster Only | 4.10 | GRC | Crystal Kenney 'GRC/Peter Verhofstadt Fellow Stanford University |
Simulations of Metal-Semiconductor Junctions with Transverse Energy Considered |
| Poster Only | 4.11 | GRC | Nicholas Wright Intel Foundation/SRCEA Fellow |
Growth of Ferroelectric BaTiO(3) Thin Films by Hybrid Molecular Beam Epitaxy |
Session 5 - Verification
| Monday, September 13 - San Marcos | ||||
|---|---|---|---|---|
| 1:10 PM | 5.1 | GRC | Everett Morse Brigham Young University |
Probing API Execution Semantics from Formal Models |
| 1:25 PM | 5.2 | GRC | Subodh Sharma Univ. of Utah |
Verification of Multi-API Programming in Heterogeneous |
| 1:40 PM | 5.3 | GRC | Brendon Bolin Univ. of California/Santa Barbara |
Calibration of a Timing Analysis Flow with a Knowledge Discovery Framework |
| 1:55 PM | 5.4 | GRC | Po-Hsien Chang Univ. of California/Santa Barbara |
Kernel-Based Verification Framework |
| 2:10 PM | 5.5 | GRC | Bryan A. Brady Univ. of California/Berkeley |
Low-Power Verification with Term-Level Abstraction |
| 2:25 PM | BREAK | |||
| 2:50 PM | 5.6 | GRC | Carven Chan Princeton University |
Verification-Driven Microarchitectural Design Compatible with RTL Flows |
| 3:05 PM | 5.7 | FCRP | Ying-Chih Wang Carnegie Mellon Univeristy |
Verification of Analog Circuits via Statistical Model Checking |
| 3:20 PM | 5.8 | GRC | Satish Batchu Univ. of Utah |
Automatic Generation of Abstract Models for Analog/Mixed-Signal Circuits |
| 3:35 PM | 5.9 | GRC | Kevin Jones Univ. of Utah |
Automated Abstraction of Labeled Hybrid Petri Nets for Verification of Embedded and Cyber-Physical Systems |
Session 6 - Multi-Core and Parallel System Design
| Monday, September 13 - Pecos | ||||
|---|---|---|---|---|
| 1:10 PM | 6.1 | GRC | Cesare Ferri Brown University |
Evaluating and Designing Energy-Aware Transactional Memory for Embedded Multicore Systems |
| 1:25 PM | 6.2 | GRC | Jiayuan Meng Univ. of Virginia |
Dynamic Adaptation of SIMD Width and Multi-Threading Depth |
| 1:40 PM | 6.3 | GRC | Adam Hartman Carnegie Mellon University |
Advancements in Lifetime-Aware Task Mapping for Embedded Chip Multiprocessors |
| 1:55 PM | 6.4 | GRC | Lukasz Szafaryn Univ. of Virginia |
Exploiting Dynamically Changing Parallelism with a Reconfigurable Array of Homogeneous Sub-cores |
| 2:10 PM | 6.5 | GRC | Zhibin Xiao Univ. of California/Davis |
An Energy-efficient Parallel H.264/AVC Baseline Encoder on a Fine-grained Many-core System |
| 2:25 PM | BREAK | |||
| 2:50 PM | 6.6 | FCRP | Shervin Sharifi Univ. of California/San Diego |
Thermal and Energy Management for Heterogeneous Embedded Multi-Processor SoCs |
| 3:05 PM | 6.7 | GRC | Karthik Ganesan Univ. of Texas/Austin |
System-level Max Power (SYMPO) - A Systematic Approach for Escalating System-Level Power Consumption using Synthetic Benchmarks |
| 3:20 PM | 6.8 | FCRP | John Sartori Univ. of Illinois/Urbana-Champaign |
Recovery-Driven Design |
| 3:35 PM | 6.9 | FCRP | Young Hoon Kang Univ. of Southern California |
Fault-Tolerant Flow Control for Soft-Error Handling in On-Chip Networks |
| Poster Only | 6.10 | GRC | Michael Boyer AMD/Mahboob Khan Fellow |
Task Sharing: Collaborative CPU-GPU Execition |
Session 7 - Cu/Low k Extendability
| Monday, September 13 - Sabine | ||||
|---|---|---|---|---|
| 1:10 PM | 7.1 | GRC | He Ren Univ. of Wisconsin/Madison |
Simulation of Vacuum-Ultraviolet Irradiation of Dielectric Layers |
| 1:25 PM | 7.2 | GRC | Swayambhu Behera Univ. of North Texas |
Influence of Oxygen Plasma and Its Constituents on Low-k Organosilicate Glass: XPS, FTIR and AFM Results |
| 1:40 PM | 7.3 | GRC | Stephanie LaBarbera Univ. at Albany - SUNY |
Nucleation, Wetting and Agglomeration Resistance of PVD Cu-Al and Cu-Mn Alloy Seeds on a Ta Liner Surface |
| 1:55 PM | 7.4 | GRC | Michael Riley Rensselaer Polytechnic Institute |
Experimental Analysis of Copper Diffusion into Porous SiCOH |
| 2:10 PM | 7.5 | GRC | Ming He Rensselaer Polytechnic Institute |
Tantalum Ion Penetration into Porous Low-k Dielectrics under Bias-Temperature Stress |
| 2:25 PM | BREAK | |||
| 2:50 PM | 7.6 | GRC | Zhiyuan Wu Univ. at Albany - SUNY |
PVD Cu Trench-Fill by Viscous Flow at High Temperatures |
| 3:05 PM | 7.7 | GRC | K.J. Ganesh Univ. of Texas/Austin |
Automated Local Texture and Stress Analysis in Cu Interconnects using D-STEM and Precession Microscopy |
| 3:20 PM | 7.8 | GRC | Lijuan Zhang Univ. of Texas/Austin |
Effects of Grain Size on Electromigration Reliability of Cu Damascene Interconnects with Different Cap Layers |
| 3:35 PM | 7.9 | GRC | Xin Liu Arizona State University |
Remote O(2), H(2), N(2), and H(2)/N(2) Plasma Processes for Cleaning Low-k Interlayer Dielectric |
| Poster Only | 7.10 | GRC | Mihir Tendulkar Intel Foundation/SRCEA Fellow |
Forming and Switching Characteristics of Low-Temperature Bilayer RRAM Structure Using RF-Sputtered Pr(0.7)Ca(0.3)MnO(3) Thin Films |
Session 8 - Patterning Materials and Systems
| Monday, September 13 - San Antonio | ||||
|---|---|---|---|---|
| 1:10 PM | 8.1 | GRC | Tristan Kolb Univ. of Bayreuth |
Physical Vapor Deposited Photo Resist Films |
| 1:25 PM | 8.2 | GRC | Gregory Toepperwein Univ. of Wisconsin/Madison |
Computational Design of Additives to Enhance Photoresist Solubility in Alternative Solvents |
| 1:40 PM | 8.3 | GRC | Marie Krysak Cornell University |
PAG and Base-Attached Molecular Glass Resists for Improved Lithographic Performance |
| 1:55 PM | 8.4 | GRC | Florian Wieberger Univ. of Bayreuth |
Dissolution Control by a Doped Developer |
| 2:10 PM | 8.5 | GRC | Nicholas Hendricks NIST/GRC Fellow Univ. of Massachusetts |
Formation of Hierarchical Silica Nanochannels with Nanoimprint Lithography |
| 2:25 PM | BREAK | |||
| 2:50 PM | 8.6 | GRC | Preetish Sinha Univ. of Wisconsin/Madison |
Response Characterization of Substrates due to Particle Entrapment during Exposure Chucking in EUV Lithography |
| 3:05 PM | 8.7 | GRC | Jacob Zeuske Univ. of Wisconsin/Madison |
EUV Lithography Mask Clamping with a Low Thermal Expansion Material Chuck |
| 3:20 PM | 8.8 | FCRP | Chuan Wang Univ. of Southern California |
Aligned Carbon Nanotubes for Beyond-CMOS NanoelectronicsAbstract |
| 3:35 PM | 8.9 | FCRP | Hayri Engin Akin Univ. of California/Riverside |
DNA as an Engineering Material: From Assembly to Computation on Silicon |
| Poster Only | 8.10 | GRC | Monica Kempsell AMAT/GRC Scholar |
Phase Pupil Filter Optimization for Optical Nanolithography |
| Poster Only | 8.11 | GRC | Lakshmi Jagannathan Intel Foundation/SRCEA Scholar |
Inkjet Printed Heaters for Biological Applications |
Session 9 - Environment, Safety, and Health
| Tuesday, September 14 - San Marcos | ||||
|---|---|---|---|---|
| 8:00 AM | 9.1 | GRC | Dinesh P R Thanu Univ. of Arizona |
Benign Deep Eutectic Solvents (DES) for Replacement of Organic Solvent Based Cleaning Formulations in Back End of Line Cleaning |
| 8:15 AM | 9.2 | GRC | Chi-cheng Chiu Univ. of Texas/Dallas |
Computer Simulations of the Interaction between Carbon Based Nanoparticles and Biological Membranes |
| 8:30 AM | 9.3 | GRC | Jeffrey Rottman Intel Foundation/SRCEA Fellow Univ. of Arizona |
Fate of CMP Nanoparticles in Municipal Wastewater Treatment |
| 8:45 AM | 9.4 | GRC | Wen Zhang Georgia Institute of Technology |
Effect of Nanoparticle Size on Adhesion Force with Bacterial Cells |
| 9:00 AM | 9.5 | GRC | Shalini Minocha Univ. of North Carolina/Chapel Hill |
Physicochemical Characterization and Toxicity Evaluation of Metal based Manufactured Nanoparticles |
| 9:15 AM | BREAK | |||
| 9:40 AM | 9.6 | GRC | Wenjie Sun Univ. of Arizona |
Sugar-Based Photoacid Generators ("Sweet" PAGs): Environmentally Friendly Materials for Next Generation Photolithography |
| 9:55 AM | 9.7 | GRC | Christine Ouyang GRC Fellow Cornell University |
Environmentally Friendly Processing of Photoresists in Supercritical Carbon Dioxide and Silicone Solvents |
| 10:10 AM | 9.8 | GRC | Rajkumar Govindarajan Univ. of Arizona |
Development of an All-Wet Benign Process Based on Catalyzed Hydrogen Peroxide (CHP) Chemical System for Stripping of Implanted State-of-the-Art Deep UV Resists |
| 10:25 AM | 9.9 | GRC | Gaurav Thareja Stanford University |
Germanium CMOS Technology for Sub-22nm ITRS Technology Node - Scalable Ultra Shallow Junctions with High Dopant Activation and GeO(2) Interfacial Layer |
| Poster Only | 9.10 | GRC | Mia McCorkel GRC Fellow |
Nanoparticle Toxicity: Chemical Absorbents Increase Cytotoxicity |
Session 10 - Digital Circuits and Systems Design (10A) and 3D Design Techniques and Tools (10B)
| Tuesday, September 14- Pecos | ||||
|---|---|---|---|---|
| Digital Circuits and Systems Design | ||||
| 8:00 AM | 10.1 | GRC | Yibo Chen Pennsylvania State University |
Minimizing Leakage Power in Aging-Bounded High-level Synthesis with Design Time Multi-Vth Assignment |
| 8:15 AM | 10.2 | GRC | Sudhir Kudva Univ. of Minnesota |
Inductors Above Digital Circuits: Towards Compact On-Chip Switching Regulators |
| 8:30 AM | 10.3 | GRC | Jiayuan Meng Univ. of Virginia |
HotPower: The Inverse HotSpot - Estimating Power Dissipation Using Thermal Maps |
| 8:45 AM | 10.4 | GRC | Muawya Al-Otoom North Carolina State University |
EXACT: EXplicit Dynamic-Branch Prediction with ACTive Updates |
| 9:00 AM | 10.5 | FCRP | Shanshan Zheng Univ. of Maryland |
Trust-Aware State Estimation Under False Data Injection In Distributed Sensor Networks |
| 9:15 AM | BREAK | |||
| 3D Design Techniques and Tools | ||||
| 9:40 AM | 10.6 | GRC | Tao Zhang Pennsylvania State University |
A 5-layer 3D Stacked Chip Prototyping for H.264 Application |
| 9:55 AM | 10.7 | GRC | Jishen Zhao Pennsylvania State University |
Reconfigurable Energy-Efficient Multi-core 3D Stacked Chip-Multiprocessor Design |
| 10:10 AM | 10.8 | GRC | Xi Chen North Carolina State University |
Thermal Adaptive Clock Design for 3D Integrated Circuits |
| 10:25 AM | 10.9 | FCRP | Young-Joon Lee Georgia Institute of Technology |
Timing Analysis and Optimization for Many-Tier 3D ICs |
| Poster Only | 10.10 | GRC | Adam Beece GLOBALFOUNDRIES/GRC Fellow |
Predicitng the Benefits of 3D Integrated Cache Systems |
Session 11 - Packaging
| Tuesday, September 14- Sabine | ||||
|---|---|---|---|---|
| 8:00 AM | 11.1 | GRC | Sri Chaitra Jy Chavali Purdue University |
Aging Aware Constitutive Models for SnAgCu Solder Alloys |
| 8:15 AM | 11.2 | GRC | Dennis Chan Purdue University |
An Information Theoretic Argument on Damage Accumulation and Fatigue Failure in SnAgCu Solder Joints |
| 8:30 AM | 11.3 | GRC | Yiwei Wang Univ. of Texas/Austin |
The Impact of Cu Pillar Bumps on the Thermomechanical Reliability and Chip-Package Interaction of Flip Chip Packages with Ultra-low k Interconnects |
| 8:45 AM | 11.4 | GRC | Haixia Mei Univ. of Texas/Austin |
Cohesive Interface Modeling of Interfacial Delamination in Integrated Thin-Film Structures |
| 9:00 AM | 11.5 | GRC | Abhishek Tambat Purdue Univeristy |
Level Sets and Topological Derivatives for Implicit 3-D Crack Propagation Simulation in Dielectric Stacks |
| 9:15 AM | BREAK | |||
| 9:40 AM | 11.6 | GRC | Shravan Gowrishankar Univ. of Texas/Austin |
Direct Determination of Interface Traction-Separation Relations |
| 9:55 AM | 11.7 | GRC | Narayanan Terizhandur V Georgia Institute of Technology |
EM/Lumped-Circuit Element Co-simulation using Z-domain Krylov Subspace Model Order Reduction |
| 10:10 AM | 11.8 | FCRP | Yan Hu Univ. of Florida |
A Current-Density Centric Logical Effort Based Design Methodology for High-Speed I/O Links |
| 10:25 AM | 11.9 | GRC | Moishe Groger Univ. of Florida |
CML VDL for High Speed Effective Sampling, Package Characterization and BIST |
Session 12 - Si, Ge and III-V Advanced Technologies
| Tuesday, September 14 - San Antonio | ||||
|---|---|---|---|---|
| 8:00 AM | 12.1 | GRC | Zuoguang Liu Yale University |
Ultra-Thin Al(2)O(3)-TiO(2) High-k Stack and Associated MOSFET Characteristics |
| 8:15 AM | 12.2 | GRC | Qun Gao Univ. of Florida |
Two-Dimensional Quantum Transport Modeling of Silicide-Silicon Contacts in Bulk and SOI MOSFETs |
| 8:30 AM | 12.3 | GRC | Krishna Iyengar Cornell University |
Modeling Temperature and Stress Profiles in 3D during Sub-millisecond Laser Spike Annealing |
| 8:45 AM | 12.4 | GRC | Mustafa Jamil Univ. of Texas/Austin |
UHVCVD Growth of Epitaxial Ge on Si(111) Through C Incorporation for Potential CMOS Applications |
| 9:00 AM | 12.5 | FCRP | Saumitra Raj Mehrotra Purdue University |
A Tight-Binding Approach for SiGe Bandstructure Calculations |
| 9:15 AM | BREAK | |||
| 9:40 AM | 12.6 | FCRP | Arif Sonnet Univ. of Texas/Dallas |
Impact of Surface Preparations and Substrate Doping on the Transport Properties of In(x)Ga(1-x)As Metal-Oxide-Semiconductor Field Effect Transistors |
| 9:55 AM | 12.7 | GRC | Uthayasankaran Peralagu Univ. of Glasgow |
The Impact of Strain Engineering on Hole Mobility of In(x)Ga(1-x)As Channels for III-V p-MOSFETs |
| 10:10 AM | 12.8 | FCRP | Wilhelm Melitz AMAT/GRC Fellow Univ. of California/San Diego |
Potential Mapping of UHV Cleaved Functional III-V MOSCAPs with Kelvin Probe Force Microscopy |
| 10:25 AM | 12.9 | NRI | Mohammad Hasan Univ. of Texas/Austin |
Stepped Broken-gap Hetero-barrier Tunnel Field Effect Transistor (HetTFET) for Ultra-low Power and High Speed |
| Poster Only | 12.10 | GRC | Nicole DiLello IBM/GRC Fellow |
Dark Current and Responsivity of Ge-on-Si Photodiodes |
| Poster Only | 12.11 | GRC | Byron Ho GRC Fellow |
Simulation Study of Germanium Channels for End-of-Roadmap CMOS Sclaing |
Session 13 - Logic/Physical Design
| Tuesday, September 15 - San Marcos | ||||
|---|---|---|---|---|
| Session 13a - Verification | ||||
| 1:10 PM | 13.1 | GRC | Hongbo Zhang Univ. of Illinois/Urbana-Champaign |
Characterization of Process-Aware Layout Modification on Regular Standard Cell Design |
| 1:25 PM | 13.2 | GRC | Yongchan Ban Univ. of Texas/Austin |
Compact Modeling and Layout Optimization for Source/Drain Contacts in Standard Cell Library |
| 1:40 PM | 13.3 | GRC | Jae-Seok Yang Univ. of Texas/Austin |
A Multi-Objective Layout Decomposition Framework for Double Patterning Lithography |
| 1:55 PM | 13.4 | GRC | Eric Chin IBM/GRC Fellow Univ. of California/Berkeley |
Variability Aware Timing Models at the Standard Cell Level |
| 2:10 PM | 13.5 | GRC | Tuck Boon Chan Univ. of California/Los Angeles |
Design Dependent Process Monitoring |
| 2:25 PM | BREAK | |||
| 2:50 PM | 13.6 | GRC | Kalliopi Tsota Purdue University |
A Linear Programming-based Approach for Routability-driven Placement |
| 3:05 PM | 13.7 | GRC | Bin Liu Univ. of California/Los Angeles |
FSM Decomposition for Interconnect Reduction in High Level Synthesis |
| 3:20 PM | 13.8 | FCRP | Zohaib Mahmood Mass. Institute of Technology |
System Level Modeling and Simulation of Analog Circuits Using Semidefinite Programming Based Compact Modeling Techniques |
| 3:35 PM | 13.9 | GRC | Zhiyu Zeng Texas A&M University |
Tradeoff Analysis and Optimization of Power Deliver Networks with On-Chip Voltage Regulation |
| Poster Only | 13.10 | GRC | Matthew Fojtik Intel Foundation/SRCEA Fellow |
A Millimeter-Scale Nearly-Perpetual Sensor System with Stacked Battery and Solar Cells |
Session 14 - Data Converter Design
| Tuesday, September 14 - Pecos | ||||
|---|---|---|---|---|
| 1:10 PM | 14.1 | GRC | Omid Rajaee Oregon State University |
Oversampled Noise-Shaped Pipelined ADC with Reduced Sensitivity to Analog Imperfections |
| 1:25 PM | 14.2 | GRC | Ramin Zanbaghi Oregon State University |
A Low-Power Stage-Shared MASH Delta-Sigma Modulator |
| 1:40 PM | 14.3 | GRC | Ramy Ahmed Texas A&M University |
Hybrid Clock-Jitter Error Shaping Technique for Feedback Digital-to-Analog Converters (DACs) in Continuous-Time Sigma-Delta Modulators |
| 1:55 PM | 14.4 | GRC | Rajan Lakshmi Narasimha Univ. of Illinois/Urbana-Champaign |
Low-Power BER-Aware ADC Architecture |
| 2:10 PM | 14.5 | FCRP | Gokce Keskin Carnegie Mellon University |
Modeling of Statistical Element Selection Based Self-Healing Analog Circuits |
| 2:25 PM | BREAK | |||
| 2:50 PM | 14.6 | GRC | Hemasundar Mohan Geddada Texas A&M University |
A Hybrid 14-bit Analog-to-Digital Converter for Broadband Applications |
| 3:05 PM | 14.7 | GRC | Tawfiq Musah Oregon State University |
Error Suppression Techniques in Pseudo-Differential Zero-Crossing-Based Circuits |
| 3:20 PM | 14.8 | GRC | Yuhan Xie Oregon State |
A 10MHz 83dB SNDR Continuous-Time Delta-Sigma ADC with 4bit SCR Feedback DAC |
| 3:35 PM | 14.9 | GRC | Jikai Chen University Univ. of Florida |
A 50mW 2.5GS/s 5-Bit ADC in 0.13um CMOS with Background Calibration for In-Situ TDR Measurements |
| Poster Only | 14.10 | GRC | Daniel Morris Intel Foundation/SRCEA Fellow |
Limited Pattern Constructs for Memory Patterned Integrated Circuits |
Session 15 - 3D and Beyond Cu/Low k
| Tuesday, September 14 - Sabine | ||||
|---|---|---|---|---|
| 1:10 PM | 15.1 | GRC | Iqbal Saraf Univ. of Texas/Dallas |
Fundamentals of Deep Silicon Etch |
| 1:25 PM | 15.2 | GRC | Hyo-Chol Koo Georgia Institute of Technology |
Chip to Substrate Interconnect by Copper Electroless Plating |
| 1:40 PM | 15.3 | GRC | Kuan Hsun Lu Univ. of Texas/Austin |
Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects |
| 1:55 PM | 15.4 | FCRP | Yue Zhang Georgia Institute of Technology |
Coupled Electrical and Thermal 3D IC Centric Microliquid Heat Sink Design |
| 2:10 PM | 15.5 | GRC | Hyung Suk Yang Georgia Institute of Technology |
Marriage of CMOS and MEMS using Flexible Interconnects and TSVs |
| 2:25 PM | BREAK | |||
| 2:50 PM | 15.6 | FCRP | Anant Balakrishnan Georgia Institute of Technology |
Bandwidth, Delay and Energy Aware Optimization of Global Interconnects for Many-Core Architectures |
| 3:05 PM | 15.7 | FCRP | Vivek Sahu Georgia Institute of Technology |
Hybrid Solid-State/Fluidic Cooling for Microprocessor |
| 3:20 PM | 15.8 | NRI | Shaloo Rakheja Georgia Institute of Technology |
Performance and Energy-Per-Bit Modeling of Interconnects for Post-CMOS Devices |
| 3:35 PM | 15.9 | FCRP | Di Yao Dartmouth College |
50-MHz V-Groove Thin-Film Power Inductors Using Multilayer Nano-Granular Magnetic Material |
Session 16 - Nano-Scale and Magnetic Devices
| Tuesday, September 14 - San Antonio | ||||
|---|---|---|---|---|
| 1:10 PM | 16.1 | NRI | Vincent Dorgan Univ. of Illinois/Urbana-Champaign |
Mobility and Velocity-Field Relationship in Graphene Above Room Temperature |
| 1:25 PM | 16.2 | NRI | Archana Venugopal Univ. of Texas/Dallas |
Transport Properties of CVD Graphene Grown on Cu, as a Function of Domain Size |
| 1:40 PM | 16.3 | NRI | Seyoung Kim Univ. of Texas/Austin |
Coulomb Drag in Independently-Contacted Graphene Bilayers |
| 1:55 PM | 16.4 | FCRP | Greg Mordi Univ. of Texas/Dallas |
Ozone Based Atomic Layer Deposition of High-k Dielectrics for Graphene Device Applications |
| 2:10 PM | 16.5 | NRI | Cheng Gong Univ. of Texas/Dallas |
The Electronic and Transport Properties of Metal-Graphene End Contacts: The DFT-NEGF Study |
| 2:25 PM | BREAK | |||
| 2:50 PM | 16.6 | NRI | Albert Liao NRI/Hans J. Coufal Fellow Univ. of Illinois/Urbana-Champaign |
Thermal Dissipation, Reliability, and Breakdown of Single-Wall Carbon Nanotubes |
| 3:05 PM | 16.7 | FCRP | Abhijeet Paul Purdue University |
Strain Engineering of Trigated Silicon Nanowire FinFETs for Improved Device Performance |
| 3:20 PM | 16.8 | NRI | En-Shao Liu Univ. of Texas/Austin |
Lateral Spin Injection in Germanium Nanowires |
| 3:35 PM | 16.9 | NRI | Edit Varga Univ. of Notre Dame |
Shape-Based Logic Built from Supermalloy Nanomagnets |
| Poster Only | 16.10 | GRC | Woo-Shul Cho | Full-Band Simulations of Band-to-Band Tunneling Diodes |
Undergraduate Research Opportunities Posters
| TechFair 1 & 3 | URO.1 | Florencia Paredes Cornell University |
Measurements of Photoacid Diffusion and Sensitivity of Chemically Amplified Resist Ssytems under Millisecond Post Exposure Bake Systems under Millisecond Post Exposure Bake |
| TechFair 2 & 4 | URO.2 | George Torres University of California/Los Angeles |
Shift-Trim Double Patterning Lithography |
| TechFair 1 & 3 | URO.3 | Liane Moreau Cornell University |
X-ray In-Situ Study of Ag Nanoparticle Nucleation and Growth for Semiconductor Interconnects |
| TechFair 2 & 4 | URO.4 | Chris Hinojosa Portland State University |
3-D Velocity Measurements around an Optically Suspended Sphere |
| TechFair 1 & 3 | URO.5 | Kwabena Agyeman Carnegie Mellon Unviersity |
The Mind and The Muscle |
| TechFair 2 & 4 | URO.6 | Kayla Fix University of Washington |
Measuring Human Skin Deformation: PEDOT:PSS Strain Gauge |
| TechFair 1 & 3 | URO.7 | Christina Fenwick North Carolina A&T University |
Effect of Mottled Temperatures and pHs on the Fatty Acid Composition of Cronobacter Sakazakii BAA-894 |
| TechFair 2 & 4 | URO.8 | Chantal Simpson North Carolina A&T University |
Sorption Capacity of Lead on Soil Mixture According to the Composition of Saharan Dust |
| TechFair 1 & 3 | URO.9 | Charnell Chasten North Carolina A&T University |
Effect of Environmental Changes on the Fatty Acid Composition of Cronobacter Sakazakii Clinical Isolates |
| TechFair 2 & 4 | URO.10 | Howard Sueing, Howard Univeristy Jamahrae Jackson, Howard University |
The Opportunistic Routing of the Washington Metropolitan Area Bus System as a Wireless Vehicualr Node Simualted Network |
| TechFair 1 & 3 | URO.11 | Jill Rodriquez University of Michigan |
Atomistic Modeling of Materials for High Capacity Lithium-Air Batteries |
| TechFair 2 & 4 | URO.12 | Shilpa Ramamurthy Carnegie Mellon Unviersity |
Walk Through Interfaces |
| TechFair 1 & 3 | URO.13 | Jesse Maddock University of Michigan |
The Kinetics of Charge Transport on Polyfluorenes with Charge-Trapping End Caps in the Presence of Sodium Cations |
| TechFair 2 & 4 | URO.14 | Alisha Gryniewicz University of Illinois/Urbana-Champaign |
Comparison of Radiation Isotope Identifiers |
| TechFair 1 & 3 | URO.15 | Juliette Logan University of Illinois/Urbana-Champaign |
Regional Neuroinflammation after Brain Irradiation |
| TechFair 2 & 4 | URO.16 | No Poster | |
| TechFair 1 & 3 | URO.17 | Cooper Levy University of California/Berkeley |
Characterization of Standard Cell Timing Variability using Geometrical Biasing |
| TechFair 2 & 4 | URO.18 | Stacy Kanaan, Oregon State University Meghan Hemphill-Johnson, Oregon State University |
Patterned Carbon Nanotube Growth: using Direct Write Lithography and PlasmaEnhanced Chemical Vapor Deposition |
| TechFair 1 & 3 | URO.19 | Elizabeth Buzzard University of Illinois/Urbana-Champaign |
Mechanical Properties of Self-Sealing Fiber Reinforced Composites |
| TechFair 2 & 4 | URO.20 | \ No Poster | |
| TechFair 1 & 3 | URO.21 | Joey Degges University of California/Los Angeles |
Interactive Data Point Reevaluation |
| TechFair 2 & 4 | URO.22 | Francisco Pelaez University of Texas/Austin |
Pair Correlation Functions for Binary Mixtures |
| TechFair 1 & 3 | URO.23 | Brett Ireland Purdue University |
Self?Healing 3?D Mixed Signal System with Temperature Effects |
| TechFair 2 & 4 | URO.24 | Gabriella Leiva University of Texas/Austin |
Binary Fluids Distribution Functions |
| TechFair 1 & 3 | URO.25 | Samuel Elia Georgia Institute of Technology |
Integrated Wireless Sensors on Flexible Organics using Inkjet-Printing Technologies |
| TechFair 2 & 4 | URO.26 | Allen Tippman Purdue University |
A Reconfigurable Tester for Microscale Mechanical Characterization of Electronic Materials |
| TechFair 1 & 3 | URO.27 | Alan Covacevich University of Texas/Austin |
Synthesis and Properties of Mono- and Few-Layer Hexagonal Boron Nitride (h-BN) |
| TechFair 2 & 4 | URO.28 | John Doyle Purdue University |
Environmental Influences on the Electronic Characteristics of Suspended Graphene Devices |
| TechFair 1 & 3 | URO.29 | Vincent Davis University of Texas/Austin |
Synthesizing Clones for the Most Optimal SPEC CPU2006 Simulation Point |
| TechFair 2 & 4 | URO.30 | Eric Roberts University of Texas/Austin |
Design of a Mixed Mode Fracture Tester for Chip-Package Systems |
| TechFair 1 & 3 | URO.31 | Jacob Warneke University of Texas/Austin |
TEM Simulations of Li(2)MnO(3) |
Session Chairs, Vice Chairs, and Judges are encouraged to review information linked from this page before coming to TECHCON. Information/Instruction packages will be provided at the confrence and abstracts will be available in the Conference Program.
Session Chairs and Vice Chairs
- Introductory letter - for Session Chairs and Vice Chairs
- Instructions/Guidelines - for Session Chairs and Vice Chairs
- List - Chairs, Vice Chairs, and Judges by session
- Session schedule - with links to sessions and abstracts (click the Paper Sessions tab above)
Judges
- Introductory letter - for Judges
- Instructions - for Judges
- List - Chairs, Vice Chairs, and Judges by session
- Judging Criteria - also provided to students
- Oral Presentation Instructions - provided to students
- Poster Instructions - provided to students
- Score Sheets - includes individual score sheets, tally sheets and decision sheet
- Session schedule - with links to sessions and abstracts (click the Paper Sessions tab above)
Hotel and Travel Information
Renaissance Austin Hotel
9721 Arboretum Boulevard
Austin, Texas 78759 USA
Toll Free: 1-800-228-9290
Phone: 1-512-343-2626
Fax: 1-512-346-7953
Group Name:TECHCON
Rate: $162
Block Release Date: Reservation cut off is Saturday, August. 21, 2010
Hotel Parking: Complimentary on-site parking; Valet parking available
Wireless: Free Internet access in public areas (lobby bar)
Airport Information
Austin-Bergstrom International Airport
Driving Directions from Austin-Bergstrom International Airport to hotel: Turn left (west) out of airport and stay on access road for 1.1 miles until you reach Hwy 183 North. Stay on Hwy 183 North for approximately 17 miles and exit at Loop 360 Capital of Texas Hwy-Great Hills Trail. Turn left at first light (over frwy -- stay in right lanes) and take very first right turn, which is Arboretum Blvd. Hotel is on the right.
Estimated taxi fare: $35.00 USD (one way)
Transportation Information
SuperShuttle: Austin direct number: (512) 258-3826; National number: 1-800-BLUE VAN (258-3826)
Yellow Cab: (512) 452-9999
Austin Cab: (512) 478-2222
Find out the who, what, where and why for SRC's premier technical conference.
| Name | Organization |
|---|---|
| Abadir, Magdy S. | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Dallas |
| Agarwal, Kanak | IBM Corporation |
|
|
Carnegie Mellon University |
|
|
Georgia Institute of Technology |
| Ahmed, Fawad | Micron Technology, Inc. |
|
|
Texas A&M University |
|
|
Univ. of California/Riverside |
| Albin, Ken | Advanced Micro Devices, Inc. |
| Al-Otoom, Muawya | North Carolina State University |
| Altman, Mary E. | Semiconductor Research Corporation |
| Antonelli, George Andrew | Novellus Systems, Inc. |
| Arledge, Lawrence A. | Texas Instruments Incorporated |
|
|
Univ. of Florida |
| Baker, Frank K | Freescale Semiconductor, Inc. |
|
|
Georgia Institute of Technology |
|
|
Univ. of Texas/Austin |
| Banerjee, Basab | GLOBALFOUNDRIES |
| Barrett, Thomas D | Intel Corporation |
| Bartlett, Gregg | GLOBALFOUNDRIES |
| Bartling, Steven | Texas Instruments Incorporated |
|
|
Univ. of Utah |
| Baumgartner, Jason | IBM Corporation |
| Beavers, Brad | Intel Corporation |
| Beckett, Sandra A. | Raytheon Company |
|
|
Rensselaer Polytechnic Institute |
|
|
Univ. of North Texas |
| Bernstein, James | Freescale Semiconductor, Inc. |
|
|
Carnegie Mellon University |
| Bhadra, Jayanta | Freescale Semiconductor, Inc. |
|
|
Carnegie Mellon University |
| Bielefeld, Jeffery D. | Intel Corporation |
|
|
Univ. of Washington |
|
|
Univ. of California/Santa Barbara |
| Bourianoff, George I. | Intel Corporation |
| Bowling, Allen | Texas Instruments Incorporated |
|
|
Univ. of Virginia |
|
|
Univ. of California/Berkeley |
| Branson, Brian | Freescale Semiconductor, Inc. |
| Brazier, Mark | Intel Corporation |
| Brenner, Michael | Novellus Systems, Inc. |
| Brogioli, Michael | Freescale Semiconductor, Inc. |
| Bromell, Pamela J. | Semiconductor Research Corporation |
| Brown, Paul V. | Applied Materials, Inc. |
| Buckley, Michele | National Inst. of Standards & Tech. |
| Bullard, Travis | GLOBALFOUNDRIES |
| Burnett, J. David | Freescale Semiconductor, Inc. |
| Burnham, Marie | Freescale Semiconductor, Inc. |
| Butler, Dennis | Raytheon Company |
| Butler, Kenneth M. | Texas Instruments Incorporated |
|
|
Univ. of Illinois/Urbana-Champaign |
| Candelaria, Jonathan J. | Semiconductor Research Corporation |
|
|
Stanford University |
| Capodieci, Luigi | GLOBALFOUNDRIES |
| Carulli, John | Texas Instruments Incorporated |
|
|
Georgia Institute of Technology |
|
|
Princeton University |
|
|
Purdue University |
|
|
Univ. of California/Los Angeles |
|
|
Univ. of Massachusetts |
|
|
Univ. of California/Santa Barbara |
|
|
Univ. of California/Santa Barbara |
|
|
North Carolina A&T State University |
|
|
Purdue University |
| Chen, An | GLOBALFOUNDRIES |
|
|
Univ. of Florida |
| Chen, Tze-Chiang | IBM Corporation |
|
|
North Carolina State University |
|
|
Pennsylvania State University |
|
|
Univ. of California/Berkeley |
|
|
Univ. of Wisconsin/Madison |
| Cho, Jin | GLOBALFOUNDRIES |
|
|
Purdue University |
| Choksi, Gaurang | Intel Corporation |
| Cleland-Horn, Teresa | Freescale Semiconductor, Inc. |
| Clewell, Lee Ann | Semiconductor Research Corporation |
| Conley, Willard E. | Freescale Semiconductor, Inc. |
| Connelly, Michael D. | Semiconductor Research Corporation |
| Cook, Myneeka | IBM Corporation |
| Corsi, Marco | Texas Instruments Incorporated |
|
|
Univ. of Texas/Austin |
| Cronin, Daniel W. | Freescale Semiconductor, Inc. |
| Dabak, Anand G. | Texas Instruments Incorporated |
| Daniel, Steven | Freescale Semiconductor, Inc. |
| Dao, Thuy B. | Freescale Semiconductor, Inc. |
| Daverse, Chris A. | Semiconductor Research Corporation |
| Daves, Glenn | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Austin |
|
|
Univ. of California/Los Angeles |
| Deshpande, Sanjay | Freescale Semiconductor, Inc. |
|
|
Mass. Institute of Technology |
| Dobson, Scott J. | Semiconductor Research Corporation |
| Doczy, Mark L. | Intel Corporation |
|
|
Carnegie Mellon University |
|
|
Univ. of Illinois/Urbana-Champaign |
|
|
Purdue University |
| Drake, Alan J. | IBM Corporation |
| Draper, Jeff | Univ. of Southern California |
|
|
Iowa State University |
| Dukovic, John O. | Applied Materials, Inc. |
|
|
Univ. of Houston |
| Edwards, Darvin R. | Texas Instruments Incorporated |
| Edwards, W. Dale | Semiconductor Research Corporation |
|
|
Georgia Institute of Technology |
|
|
Columbia University |
| Faiers, Leslie | Semiconductor Research Corporation |
| Fan, Yanli | Texas Instruments Incorporated |
| Feddeler, James R. | Freescale Semiconductor, Inc. |
|
|
North Carolina A&T State University |
|
|
Univ. of Texas/Austin |
|
|
Brown University |
|
|
Univ. of Michigan |
| Francisco, Daniel | Francisco Group |
| Fu, Lei | Advanced Micro Devices, Inc. |
|
|
Stanford University |
| Gandhi, Sundar | Tokyo Electron Limited (TEL) |
|
|
Univ. of Texas/Austin |
|
|
Univ. of Texas/Austin |
|
|
Univ. of Florida |
|
|
Southern Methodist University |
| Gasquet, Horacio | Freescale Semiconductor, Inc. |
| Gattiker, Anne E. | IBM Corporation |
|
|
Texas A&M University |
|
|
Stanford University |
| Gill, Sandeep | Arizona State University |
| Goel, Niti | Intel Corporation |
| Goertz, Patrick | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Dallas |
| Gonzalez, Pedro | GLOBALFOUNDRIES |
|
|
Univ. of Arizona |
|
|
Univ. of Texas/Austin |
|
|
Univ. of Florida |
| Grose, Bill | Texas Instruments Incorporated |
|
|
Univ. of Illinois/Urbana-Champaign |
| Gupta, Aseem | Freescale Semiconductor, Inc. |
| Haak, Robert | Insight InterAsia |
| Hansen, Ken | Freescale Semiconductor, Inc. |
| Hargrove, Michael J. | GLOBALFOUNDRIES |
| Haroun, Baher | Texas Instruments Incorporated |
|
|
Carnegie Mellon University |
|
|
Univ. of Texas/Austin |
| Havemann, Robert H. | Semiconductor Research Corporation |
|
|
Rensselaer Polytechnic Institute |
|
|
Oregon State University |
| Henderson, Rashaunda M. | Univ. of Texas/Dallas |
|
|
Univ. of Massachusetts |
| Herman, Richard | Univ. of Illinois/Urbana-Champaign |
| Herr, Daniel J. C. | Semiconductor Research Corporation |
| Higgins, Leo | Freescale Semiconductor, Inc. |
| Hillenius, Steven J. | Semiconductor Research Corporation |
|
|
Portland State University |
|
|
Univ. of California/Berkeley |
| Hoefler, Alexander B | Freescale Semiconductor, Inc. |
| Holland, Charles | DARPA |
| Holt, James C. | Freescale Semiconductor, Inc. |
|
|
Waseda University |
| Hosack, Harold H. | Semiconductor Research Corporation |
| Hsueh, Tzu-Chien | Univ. of California/Los Angeles |
|
|
Univ. of Florida |
| Hung, Chih-Ming | Texas Instruments Incorporated |
| Iacoponi, John | GLOBALFOUNDRIES |
| Ignatowski, Michael | Advanced Micro Devices, Inc. |
|
|
Georgia Institute of Technology |
|
|
Univ. of Texas/Dallas |
|
|
Cornell University |
|
|
Howard University |
|
|
Univ. of California/Berkeley |
|
|
Univ. of Texas/Austin |
| Jandhyala, Srikar | Univ. of Texas/Dallas |
| Johnson, Kristie | North Carolina A&T State University |
| Joiner, Bennett | Freescale Semiconductor, Inc. |
|
|
Univ. of Utah |
| Joyner, William H. | Semiconductor Research Corporation |
|
|
Oregon State University |
|
|
Univ. of Southern California |
| Kaplan, David | Intel Corporation |
| Karlsson, Olov | GLOBALFOUNDRIES |
| Karnik, Tanay | Intel Corporation |
| Kaul, Himanshu | Intel Corporation |
| Kazior, Thomas | Raytheon Company |
| Kemp, Kevin G. | Freescale Semiconductor, Inc. |
|
|
Rochester Institute of Technology |
|
|
Stanford University |
|
|
Carnegie Mellon University |
| Khazhinsky, Michael | Freescale Semiconductor, Inc. |
| Kim, Moon | Univ. of Texas/Dallas |
|
|
Univ. of Texas/Austin |
| Kluth, Jon | GLOBALFOUNDRIES |
| Kobayashi, Masaharu | IBM Corporation |
|
|
Univ. of Bayreuth |
|
|
North Carolina State University |
|
|
Georgia Institute of Technology |
| Koschmieder, Thomas | Freescale Semiconductor, Inc. |
| Kramer, Steve | Micron Technology, Inc. |
| Krishnan, Srikanth | Texas Instruments Incorporated |
| Krivokapic, Zoran | GLOBALFOUNDRIES |
|
|
Cornell University |
|
|
Univ. of Minnesota |
| Kuhn, Markus | Intel Corporation |
| Kumar, Rakesh | Univ. of Illinois/Urbana-Champaign |
| Kyser, David | Applied Materials, Inc. |
|
|
Univ. at Albany - SUNY |
|
|
Texas A&M University |
| Lavoie, Adrien R. | Novellus Systems, Inc. |
| Lee, Beomseop | Univ. of California/Riverside |
| Lee, Bongki | Univ. of Texas/Dallas |
| Lee, Gill | Applied Materials, Inc. |
|
|
Univ. of California/San Diego |
|
|
Univ. of Texas/Dallas |
|
|
Columbia University |
|
|
Georgia Institute of Technology |
|
|
Univ. of Texas/Austin |
| Levinson, Harry J. | GLOBALFOUNDRIES |
|
|
Univ. of California/Berkeley |
|
|
Univ. of Illinois/Urbana-Champaign |
| Lin, Ming-Ren | GLOBALFOUNDRIES |
| List, R. Scott | Semiconductor Research Corporation |
| Little, Scott | Freescale Semiconductor, Inc. |
| Liu, Bill Y. | GLOBALFOUNDRIES |
|
|
Univ. of California/Los Angeles |
|
|
Univ. of Texas/Austin |
| Liu, Frank | IBM Corporation |
| Liu, Junjun | Tokyo Electron Limited (TEL) |
|
|
Arizona State University |
|
|
Yale University |
|
|
Univ. of Illinois/Urbana-Champaign |
|
|
Univ. of Texas/Austin |
| Lundstrom, Mark S. | Purdue University |
| Luning, Scott | GLOBALFOUNDRIES |
|
|
Univ. of Connecticut |
|
|
Georgia Institute of Technology |
|
|
Univ. of Michigan |
| Mahajan, Ravi V. | Intel Corporation |
|
|
Mass. Institute of Technology |
| Maier, Shirley | Intel Corporation |
| Majhi, Prashant | Intel Corporation |
| Maloney, Marilyn | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Austin |
| Markosian, Ara | Mentor Graphics Corporation |
| Martinez, Tera | Texas Instruments Incorporated |
| Maszara, Witek | GLOBALFOUNDRIES |
| Mathew, Varughese | Freescale Semiconductor, Inc. |
| Mathur, Guru | Texas Instruments Incorporated |
| Mathur, Rajiv | Intel Corporation |
| Mayberry, Michael C. | Intel Corporation |
|
|
Univ. of Arizona |
|
|
Purdue University |
|
|
Univ. of Texas/Austin |
|
|
Univ. of California/San Diego |
| Menezes, Noel A. | Intel Corporation |
|
|
Univ. of Virginia |
| Merzbacher, Celia I. | Semiconductor Research Corporation |
| Miller, Hillel | Freescale Semiconductor, Inc. |
| Miller, Robert J. | GLOBALFOUNDRIES |
|
|
Univ. of North Carolina/Chapel Hill |
|
|
Univ. of Texas/Dallas |
|
|
Cornell University |
| Morgan, Mark W. | Texas Instruments Incorporated |
|
|
Carnegie Mellon University |
| Morrison, Gary R. | Freescale Semiconductor, Inc. |
|
|
Brigham Young University |
| Mouli, Chandra V. | Micron Technology, Inc. |
|
|
Stanford University |
| Mujica, Fernando | Texas Instruments Incorporated |
| Naik, Mehul | Applied Materials, Inc. |
| Napier Harrison, Dani | Intel Corporation |
|
|
Univ. of Illinois/Urbana-Champaign |
| Nash, Jim | Freescale Semiconductor, Inc. |
| Nassif, Sani | IBM Corporation |
| Newmark, David M. | Advanced Micro Devices, Inc. |
| Ng, Kwok | Semiconductor Research Corporation |
| Nikonov, Dmitri | Intel Corporation |
| Ning, Tak H. | IBM Corporation |
| Nixon, Paul | Texas Instruments Incorporated |
| Nuckolls, Ed | Freescale Semiconductor, Inc. |
| O, Kenneth K. | Univ. of Texas/Dallas |
| Obeng, Yaw | National Inst. of Standards & Tech. |
| Onsongo, David | IBM Corporation |
|
|
Cornell University |
| Ouyang, Qiqing Christi | IBM Corporation |
|
|
Univ. of Arizona |
|
|
Arizona State University |
|
|
Univ. of California/Irvine |
| Pandya, Mihir | Freescale Semiconductor, Inc. |
|
|
Cornell University |
| Parkhurst, Jeffrey R. | Intel Corporation |
|
|
Purdue University |
|
|
Univ. of Texas/Austin |
|
|
Univ. of Glasgow |
| Pham, Dac | Freescale Semiconductor, Inc. |
| Pham, Tim | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Dallas |
| Pigott, John | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Dallas |
|
|
Univ. of Bologna |
|
|
Oregon State University |
|
|
Georgia Institute of Technology |
| Raley, Brian | GLOBALFOUNDRIES |
| Ramamurthy, Hema | Freescale Semiconductor, Inc. |
|
|
Carnegie Mellon University |
| Ramming, James C. | Intel Corporation |
| Rao, Rahul M. | IBM Corporation |
| Rathsack, Benjamen M. | Tokyo Electron Limited (TEL) |
| Rawat, Shishpal | Intel Corporation |
| Read, Bill | Freescale Semiconductor, Inc. |
| Refai-Ahmed, Gamal | Advanced Micro Devices, Inc. |
| Reicks, Jason R. | Novellus Systems, Inc. |
| Reid, Jon | Novellus Systems, Inc. |
|
|
Univ. of Wisconsin/Madison |
| Renaud, Paul | GLOBALFOUNDRIES |
| Renfrew, Colin | Freescale Semiconductor, Inc. |
| Reuben, Jerome | Raytheon Company |
| Reuss, Patrick J. | GLOBALFOUNDRIES |
| Rey, Juan C. | Mentor Graphics Corporation |
| Reynolds, Cindy | Freescale Semiconductor, Inc. |
| Rhee, Seung-Hyun | GLOBALFOUNDRIES |
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|
Rensselaer Polytechnic Institute |
| Ritzdorf, Tom | Applied Materials, Inc. |
|
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Univ. of Texas/Austin |
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Univ. of Michigan |
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Univ. of Arizona |
| Rutenbar, Rob A. | Univ. of Illinois/Urbana-Champaign |
| Ryan, Michael | Intel Corporation |
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Carnegie Mellon University |
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|
Georgia Institute of Technology |
| Samavedam, Srikanth B. | GLOBALFOUNDRIES |
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|
Johns Hopkins University |
|
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Univ. of Texas/Dallas |
|
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Univ. of Illinois/Urbana-Champaign |
| Schreiber, Russell | Advanced Micro Devices, Inc. |
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Georgia Institute of Technology |
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|
Univ. of California/Riverside |
| Shapiro, Michael | IBM Corporation |
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|
Univ. of California/San Diego |
| Sharma, Mahesh | Advanced Micro Devices, Inc. |
| Sharma, Puneet | Freescale Semiconductor, Inc. |
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|
Univ. of Utah |
| Shaviv, Roey | Novellus Systems, Inc. |
| Shelman, Mark | Semiconductor Research Corporation |
| Shinada, Takahiro | Waseda University |
| Shirland, Stacey | Semiconductor Research Corporation |
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|
North Carolina A&T State University |
|
|
Univ. of Wisconsin/Madison |
| Sivagnaname, Jay | Freescale Semiconductor, Inc. |
| Smith, Jeffrey P. | Texas Instruments Incorporated |
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|
Univ. of Texas/Dallas |
| St. Louis-Weber, Michelle | Intel Corporation |
| Stage, Roger | Intel Corporation |
| Stephens, Alexandra | Semiconductor Research Corporation |
| Stettler, Mark A. | Intel Corporation |
| Su, Michael | Advanced Micro Devices, Inc. |
|
|
Howard University |
| Sultan, Akif | GLOBALFOUNDRIES |
| Sumney, Larry W. | Semiconductor Research Corporation |
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|
Univ. of Arizona |
| Sundareswaran, Savithri | Freescale Semiconductor, Inc. |
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|
Univ. of Virginia |
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|
Univ. of California/Berkeley |
|
|
Purdue University |
| Taylor, Marci | Applied Materials, Inc. |
| Taylor, Ted | Micron Technology, Inc. |
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|
Stanford University |
|
|
Georgia Institute of Technology |
|
|
Univ. of California/Riverside |
|
|
Univ. of Utah |
| Thomas, Donald E. | Carnegie Mellon University |
| Thomas, Erv R. | GLOBALFOUNDRIES |
|
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North Carolina State University |
| Thompson, Patrick F. | Texas Instruments Incorporated |
| Thoziyoor, Shyamkumar | IBM Corporation |
|
|
Purdue University |
|
|
Univ. of Wisconsin/Madison |
| Topaloglu, Rasit O. | GLOBALFOUNDRIES |
|
|
Univ. of California/Los Angeles |
| Tran, Tuyen | Intel Corporation |
| Trimble, Tina | GLOBALFOUNDRIES |
|
|
Purdue University |
| Turkot, Bob | Intel Corporation |
| Vaglica, John | Freescale Semiconductor, Inc. |
|
|
Carnegie Mellon University |
| van den Hoek, Wilbert | Novellus Systems, Inc. |
|
|
Univ. of Notre Dame |
| Veeraraghavan, Surya | Freescale Semiconductor, Inc. |
|
|
Univ. of Texas/Dallas |
| Venugopal, Ramesh | Texas Instruments Incorporated |
| Viswanathan, Ravi | Advanced Micro Devices, Inc. |
| Vrotsos, Thomas A. | Texas Instruments Incorporated |
| Walker, Duncan M. | Texas A&M University |
| Walstra, Steven V. | Intel Corporation |
|
|
Univ. of Southern California |
| Wang, Li-C | Univ. of California/Santa Barbara |
|
|
Univ. of Connecticut |
|
|
Carnegie Mellon University |
|
|
Univ. of Texas/Austin |
|
|
Univ. of Texas/Austin |
| Waterbury, Mark | GLOBALFOUNDRIES |
| Weitzman, Elizabeth | Semiconductor Research Corporation |
| Welser, Jeffrey J. | Semiconductor Research Corporation |
| White, Ted R. | Freescale Semiconductor, Inc. |
|
|
Univ. of Bayreuth |
| Wiggins, Virginia C. | Semiconductor Research Corporation |
| Wilson-Body, Pia D. | Intel Corporation |
| Winemberg, LeRoy | Freescale Semiconductor, Inc. |
| Wise, Rick | Texas Instruments Incorporated |
| Withers, B. Edward | Semiconductor Research Corporation |
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Univ. of California/Santa Barbara |
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Univ. at Albany - SUNY |
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Univ. of California/Davis |
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Oregon State University |
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Georgia Institute of Technology |
|
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Univ. of Texas/Austin |
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Dartmouth College |
| Yeh, David C. | Semiconductor Research Corporation |
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Arizona State University |
|
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Texas A&M University |
| Yin, Tod | Freescale Semiconductor, Inc. |
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Univ. of Houston |
| Yu, Shaofeng | Texas Instruments Incorporated |
| Yuan, Yuan | Freescale Semiconductor, Inc. |
| Yue, Henry | Tokyo Electron Limited (TEL) |
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Oregon State University |
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Texas A&M University |
|
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Univ. of Wisconsin/Madison |
| Zhan, Yaping | Advanced Micro Devices, Inc. |
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Univ. of Illinois/Urbana-Champaign |
|
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Univ. of Texas/Austin |
|
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Pennsylvania State University |
|
|
Georgia Institute of Technology |
| Zhang, Xuefeng | Advanced Micro Devices, Inc. |
| Zhang, Yongxi | Texas Instruments Incorporated |
|
|
Georgia Institute of Technology |
|
|
Pennsylvania State University |
|
|
Univ. of Maryland |
| Zhou, Feng | Freescale Semiconductor, Inc. |
|
|
Univ. of North Texas |
| Zou, Yi | GLOBALFOUNDRIES |
|
|
Columbia University |
| Date | Event Summary |
|---|---|
| 15 September 2010 ![]() | Student Relations Technical Advisory Board Austin, TX, United States |
| 15 September 2010 ![]() | Value Chain Technical Advisory Board Austin, TX, United States |
| 13 September 2010 ![]() | NEW — Alumni Association Luncheon TECHCON 2010 Austin, TX, United States Networking luncheon for alumni To register send email to: alumni@src.org |



Semiconductor Research Corporation