Overview

Interconnect and Packaging Sciences (IPS) is working to create and explore advanced evolutionary and revolutionary technologies for connecting elemental devices to each other and the macro world. IPS also strives to facilitate strong bridges and foster new ideas between the packaging and interconnect communities in the universities and member companies. IPS sponsors innovative university research resulting in an educated and talented professional staff in the areas of Interconnect and Packaging Sciences. One of the key strategies for IPS is to create a balanced research environment that meets the needs of all members while encouraging cross-thrust networking, strategic discovery and breakthrough research.

Research Focus

IPS is organized into two technical thrusts and will maintain the integrity of both while emphasizing common interest programs. IPS will also target new programs at n+3 and beyond while emphasizing critical problems that transcend nodes.

BACK END PROCESSES

Back End Processes focuses on research programs that address new directions for interconnects in the areas of Cu-low k extendability, unit processes, reliability, novel global interconnect solutions, plasma/CUD processing, and radical new concepts for interconnect and the package/on-chip interconnect sub-system.

PACKAGING

Packaging focuses on research programs that address new directions for packaging in the areas of global interconnects, thermal management and control, materials and interfaces, and radical new concepts for packaging and the package on-chip interconnect sub-system.

Science Area Management

Science Area Director

Jon Candelaria

Science Area Coordinating Committee

The IPS SACC works with the Science Area Director to develop the annual Strategic and Operations Plans, solicit and evaluate university research proposals based on needs documents developed by member task forces, conduct periodic reviews of sponsored university research, and sponsor technical reviews and transfer courses for members and university participants.

Technical Advisory Boards

TABs in Back End Processes and Packaging assist in solicitations and evaluating work in these areas.