Director, GRC Interconnect and Packaging Sciences
Jon Candelaria has over 35 years of experience in the electronics industry in a wide variety of engineering and managerial roles. He was most recently a Distinguished Member of the Technical Staff at Motorola's Applied Research & Technology Center before joining the SRC in September, 2010 as the Director for Interconnect and Packaging Sciences.
He has over a dozen issued patents and published technical articles, and received the Motorola Patent of the Year Award for an invention which contributed over $1B to Motorola over the course of its lifetime.
Jon has been an invited speaker on a wide range of topics and has led or participated in many industrial consortia activities such as the Science Advisory Council for the SRC, the National Optoelectronic Technology Research Task Force, the SIA's Semiconductor Technology Roadmap for CMOS, etc.
Jon served as Technical Program Chair and General Chair of the IEEE Electron Devices Society's flagship conference, the IEDM.
Jon was the V.P. of Conferences for the IEEE’s Electron Devices Society (EDS), the EDS representative on a joint United Nations-IEEE Humanitarian Challenge advisory committee, and was Chair of both the IEEE Computer Society and Laser and Electro Optics Society Phoenix Chapters.
Jon is currently the Treasurer and Technical Program Committee member for the International Interconnect Technology Conference (IITC), and is a member of the Editorial Panel for Future Fabs International.