2025 Innovation Award
US 10444279B2: "Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels"
Professor Krishnendu Chakrabarty (Arizona State University) receives this honor for developing a novel Design-for-Test (DfT) architecture, U.S. Patent US10444279B2, that enables pre-bond parametric testing of through-silicon vias (TSVs). This technology allows early defect detection, improving yield and reliability in advanced 3D integrated circuits. Chakrabarty’s work has been widely recognized and adopted in the semiconductor industry, including by companies like Intel, Mentor Graphics, Samsung, TSMC, NXP, and Qualcomm.
Chakrabarty’s distinguished career includes 950 peer-reviewed papers, nearly 30 books, and 24 patents. His current research is in the areas of design-for-test of 3D integrated circuits and heterogeneous integration, AI accelerators, microfluidic biochips, hardware security, and AI for healthcare. Congratulations, Professor Chakrabarty!
