2020 Mahboob Khan Outstanding Liaison Award Winners

• Scott Clendenning, Intel, nominated by:

  Seung Keun Song, NC State, and Gregory Parsons, NC State, for support of "Orthogonal Dielectric/Metal Selective Area Atomic Layer Deposition" (GRC 2729.001)

  Gregory Parsons, NC State, for support of "Area‐Selective Oxidative‐Molecular Layer Deposition of Polymers" (GRC 2873.001)

  Cheol Seong Hwang, Seoul National Univ., for support of "Atomic Layer Deposition of non-GST Chalcogenides for Selector/Resistor Elements in Next-generation Non-volatile Memory Applications" (GRC 2827.001)

• Carlos H. Diaz, TSMC, nominated by:

  Shan X. Wang, Stanford, for support of "Exploring new Topological Materials and Interfaces for Advanced SOT-MRAM" (JUMP 2776.056)

  Eric Pop, Stanford, for support of "Interfacial Phase Change Memory (IPCM): Scaling, Performance Optimization and Understanding the Physics of Switching" (GRC 2826.001)

  Zhihong Chen, Purdue, for support of "NEW materials for LogIc, Memory and InTerconnects (nCORE 2819)

• Georgios Dogiamis, Intel, nominated by:

  Ruonan Han, MIT, for support of "Sub-THz Transceiver for Ultra-Broadband Wireline Communications" (MSR-Intel 2752.001)

• Sean Eilert, Micron, nominated by:

  Anand Sivasubramaniam, Penn State, for support of "Center for Research on Intelligent Storage and Processing-in-memory" (JUMP 2780)

• Yanli Fan, TI, nominated by:

  Ping Gui, SMU, for support of " GS/s ADC Based Cycle-to-Cycle Closed-Loop Adaptive Smart Driver for High-Performance SiC/GaN Power Devices" (GRC 2810.010)

• Vincent Gambin, Northrop Grumman, nominated by:

  Suman Datta, Univ. of Notre Dame, for support of "Synthetic Heterostructures with Extremely Non-linear Electronic Response" (JUMP 2776.006)

  Suman Datta, Univ. of Notre Dame, for support of "Selectors for Cross-point Stacked and Vertical 3D Memories" (JUMP 2776.007)

• Tanay Gosavi, Intel, nominated by:

  Ramamoorthy Ramesh, UC/Berkeley, for support of "Soft MTJs for P‐transistor Read‐out" (nCORE 2759.001)

  Ramamoorthy Ramesh, UC/Berkeley, for support of "Multiferroics Material Stacks for Voltage Controlled Switching" (nCORE 2759.002)

  Sunil Bhave, Purdue, for support of "Strain Assisted Magneto-electric Write and Read Operations" (GRC 2830.001)

• Jose A. Joao, Arm, nominated by:

  Benjamin C. Lee, Duke, for support of "Dynamic Power Allocation for Efficient System-on-Chip Scaling" (GRC 2821.001)

• Rajiv V. Joshi, IBM, nominated by:

  Yu Cao, Arizona State, for support of "Neural Fabrics" (JUMP 2777.005)

• Shy-Jay Lin, TSMC, nominated by:

  Jian-Ping Wang, Univ. of Minnesota, for support of "Spin Orbit and Spin Hall Effect Devices" (JUMP 2776.02)

  Jian-Ping Wang, Univ. of Minnesota, for support of "Voltage Controlled Magnetic Anisotropy (VCMA)" (JUMP 2776.022)

  Jian-Ping Wang, Univ. of Minnesota, for support of "Fabricate and Characterize Weyl and Dirac Semimetal Thin Films" (nCORE 2861.001)

  Jian-Ping Wang, Univ. of Minnesota, for support of "Grow Topological Insulator Thin Films and Heterostructures with Magnetic Oxides" (nCORE 2861.002)

  Deliang Fan, Arizona State, for support of "Exploration of in-Memory Processing Unit (MPU) Based on Novel Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)" (nCORE 2968.001)

• Lei Ma, NXP, nominated by:

  Kevin G. Kemp, NXP, for support of "Multi-Modal BIST Design and Test Metrics Evaluation for Analog/RF Circuits" (GRC 2712.003)

• Kareem Madkour, Mentor (Siemens), nominated by:

  Yiorgos Makris, UT/Dallas, for support of "Machine Learning-Based Layout Analysis and Netlist Optimization for Defect Tolerance and Design Robustness to Process Imperfections and Variations" (GRC 2810.025)

• Pietro Mercati, Intel, nominated by:

  Tajana S. Rosing, UC/San Diego, for support of "End-to-End Exploration and Optimization of IoT Systems with Application to Automated Maintenance and Preventive Control" (GRC 2805.001

  Tajana S. Rosing, UC/San Diego, for support of "Design Space Exploration of Heterogeneous SoCs using Multi-Objective Bayesian Optimization" (GRC 2808.001)

• Mansour Moinpour, EMD Perform. Matls., nominated by:

  Charles H. Winter, Wayne State, for support of "Thermal Atomic Layer Deposition of Cobalt Titanium and Other Metal Alloy Films" (JUMP 2776.057)

• Scott A. Morrison, TI, nominated by:

  Pallab Dasgupta, IIT Kharagpur, for support of "Design Automation for Coverage Management in Analog and Mixed-Signal SOCs" (GRC 2810.019)

• Aelan Mosden, TEL, nominated by:

  Alain Diebold, SUNY POLY, for support of "Determining the Sensitivity of Metrology to Changes in Multi-Nanowire and Multi-Nanosheet FETs" (GRC 2794.001)

• Gi-Joon Nam, IBM, nominated by:

  Jiang Hu, Texas A&M, for support of "A Collaborative Machine Learning Approach to Fast and High-Fidelity Design Prediction - Texas A&M" (GRC 2810.021)

  Jiang Hu, Texas A&M, for support of "A Collaborative Machine Learning Approach to Fast and High-Fidelity Design Prediction - Duke University" (GRC 2810.022)

• Eriko Nurvitadhi, Intel, nominated by:

  Nuno Pereira, Carnegie Mellon Univ., for support of "Programming for Reconfigurable Hardware" (JUMP 2779.024)

• Rubin A. Parekhji, TI, nominated by:

  William R. Eisenstadt, Univ. of Florida, for support of "Test Techniques to Approach Several Defect-per-billion for Power ICs" (GRC 2712.018)

• Stefano Pietri, NXP, nominated by:

  Visvesh S. Sathe, Univ. of Washington, for support of "Robust, Efficient All-Digital SIMO Converters for Future SOC Domains" (GRC 2712.006)

  Ramesh Harjani, Univ. of Minnesota, for support of "Direct-Battery-to-Silicon Power Transfer in Advanced Nanometer CMOS" (GRC 2712.008)

• Prakash Ramrakhyani, Arm, nominated by:

  Moinuddin Qureshi, Georgia Tech, for support of "Rethinking Cache Management for 3D Memory Systems" (GRC 2730.001)

• Hongbo Rong, Intel, nominated by:

  Zhiru Zhang, Cornell, for support of "Compilation" (JUMP 2780.006)

• Katrina Rook, Veeco, nominated by:

  Santosh K. Kurinec, RIT, for support of "HfO2 Based Ferroelectric FET and Tunnel Junctions for Non-Volatile Logic-in-Memory and Neuromorphic Computing" (GRC 2825.001)

• Sandeep Shantaram, NXP, nominated by:

  Kenneth Liechti, UT/Austin, for support of "Effect of Temperature and Humidity on Interfacial Adhesion for Packaging" (GRC 2886.001)

• Harsono Simka, Samsung, nominated by:

  Peide Ye, Purdue, for support of "Orbitally Engineered Wide-gap Complementary TMO FETs with Record Ion-Ioff Current Ratios" (JUMP 2776.005)

  Andrew Kummel, UC/San Diego, for support of "Selective ALD of Metal Silicide" (JUMP 2776.008)

  Andrew Kummel, UC/San Diego, for support of "Self-aligned Monolayer (SAM) Enabled Interconnect Barrier at the Atomic Limit" (JUMP 2776.01)

  Peide Ye, Purdue, for support of "Negative Capacitance FETs" (JUMP 2776.014)

  Peide Ye, Purdue, for support of "Hetero-integration of Microwave and Millimeter Dielets" (JUMP 2776.034)

  Charles H. Winter, Wayne State, for support of "Thermal Atomic Layer Deposition of Cobalt Titanium and Other Metal Alloy Films" (JUMP 2776.057)

  Andrew Kummel, UC/San Diego, for support of "Novel Routes to ALD of Crystalline Materials at Low Temperature" (JUMP 2776.058)

  Zhihong Chen, Purdue, for support of "NEW materials for LogIc, Memory and InTerconnects (nCORE 2819)

• David E. Speed, GLOBALFOUNDRIES, nominated by:

  Damian Helbling, Cornell, for support of "Comprehensive Characterization of Per- and Polyfluorinated Substances (PFASs) in Fab Wastewater and Their Fate and Transformation during Activated Sludge Treatment" (GRC 2818.002)

• Sreenivas Subramoney, Intel, nominated by:

  Preeti R. Panda, IIT Delhi, for support of "Memory Hierarchy Bandwidth Management in Multiprocessor Systems-on-Chip" (GRC 2738.001)

• Jonathan Sun, IBM, nominated by:

  Supriyo Datta, Purdue, for support of "Theoretical Framework for Spintronics" (JUMP 2776.019)

• Han Wui Then, Intel, nominated by:

  Debdeep Jena, Cornell, for support of "Wide-Bandgap Piezoelectric Semiconductors for Active RF Filters" (JUMP 2776.062)

  Debdeep Jena, Cornell, for support of "Low-cost AlN/GaN/AlN HEMTs on Si Substrates" (JUMP 2778.021)

  Huili Xing, Debdeep Jena, Samuel J. Bader, and Reet Chaudhuri, all of Cornell, for support of "Signal Processing Architectures for Low-resolution Front-ends and Massive Scale MIMO" (JUMP 2778.002)

  Huili Xing and Debdeep Jena of Cornell, for support of "650GHz and 1080GHz Monolithically Integrated Signal Sources Integrating AlN/GaN/AlN HEMTs and Harmonic Multipliers" (JUMP 2778.022)

  Tomas Palacios, MIT, for support of "Low-Temperature 3D Integration of Wide Bandgap RF and Power Electronics on Si CMOS Platform" (GRC 2963.001)

• Patrick F. Thompson, TI, nominated by:

  Choong-Un Kim, UT/Arlington, for support of "Comprehensive Evaluation of Electromigration Failure in Electronic Packaging for Enhanced Reliability Prediction and Design" (GRC 2789.001)

• Enis Tuncer, TI, nominated by:

  Robert Hebner, UT/Austin, for support of "High Voltage PWM Multi-level Generator for Insulation System Testing" (GRC 2882.001)

• Swagath Venkataramani, IBM, nominated by:

  Anand Raghunathan, Purdue, for support of "Neural Fabrics" (JUMP 2777.005)

  Anand Raghunathan, Purdue, for support of "Programming and Evaluation Framework" (JUMP 2777.006)

• John Ross Wallrabenstein, ADI, nominated by:

  Doug Gardner, ADI, for support of "Side-Channel Analysis and Resiliency Targeting Accelerators" (GRC 2687.00)

• Gangyao Wang, TI, nominated by:

  Bilal Akin, UT/Dallas, for support of "Fault Characterization and Degradation Monitoring of SiC Devices" (GRC 2712.026)

• Jaimal Williamson, TI, nominated by:

  Suresh Sitaraman, Georgia Tech, for support of "Inspection Metrology: Assessments of 1st Level Joint Interconnect and Inner Package Interconnection Qualities for Improved Understanding of Chip to Package Interaction: Using Laser Ultrasonic Inspection Technique" (GRC 2790.001)

• Paul Work, Raytheon Technologies, nominated by:

  Mircea R. Stan, Univ. of Virginia, for support of "Organization and Hierarchy" (JUMP 2780.001)

  Mircea R. Stan, Univ. of Virginia, for support of "Evaluation through Architecture Simulation and Prototyping" (JUMP 2780.005)

• Gary Xu, Samsung, nominated by:

  Mark Rodwell, UC/Santa Barbara, for support of "High-Resolution THz Imaging Testbed" (JUMP 2778.027)

• See-Hun Yang, IBM, nominated by:

  Sayeef Salahuddin, UC/Berkeley, for support of "Spin Orbit and Spin Hall Effect Devices" (JUMP 2776.02)

  Sayeef Salahuddin, UC/Berkeley, for support of "Current Driven (Anti)Ferro-Magnetic Memory" (JUMP 2776.021)

• Xin Zhang, IBM, nominated by:

  Arijit Raychowdhury, Georgia Tech, for support of "Ultra-efficient Power Conversion and Distribution" (JUMP 2776.033)