Conference Preview

TECHCON is the primary event for SRC to showcase the best of research sponsored by the membership and students performing the research. It is also the venue for recognizing industry and university participants who make SRC a world-class research management organization. TECHCON 2015 will include research presentations from GRC, STARnet, NRI, and ERI in integrated sessions. Primary elements of TECHCON are outlined below.

Over 150 Technical Papers

TECHCON provides a cross-disciplinary snapshot of state-of-the-art research. The technical papers selected represent a summary of the best research in SRC’s portfolio across all SRC's research programs.

The technical papers selected represent a summary of the best research in SRC’s portfolio across all SRC's research programs. Papers are divided into sessions organized around technical areas of particular interest to SRC membership. Presenters also make a poster presentation during a TechFair session that allows for one on one discussions. 


TechFair is a series of poster sessions and the best place to talk to the top graduate students in semiconductor-related fields. Posters will be displayed with students available for discussion in the TechFair exhibit session immediately following their paper presentations.

Outstanding Speakers

Opening Keynote Session: Doug Hanson will be discussing creating success through positive shifts in skills, mindset, energy, and connection.

Banquet Keynote Address: Information coming soon


SRC member companies will be operating booths on Tuesday afternoon targeting graduate students. CareerConnections will be followed by an buffet dinner and session award presentations.

Technical Excellence Award

The Technical Excellence Award is an incentive and recognition program for research of exceptional value to the SRC community. The award is shared among key contributors to technology that significantly enhances the productivity/competitiveness of the North American semiconductor industry. Come to Monday’s conference banquet to find out which research team will take home the $5,000 cash prize.

Mahboob Khan Outstanding Liaison Awards

The Mahboob Khan Outstanding Liaison Awards are lifetime awards recognizing individuals who, in serving as SRC Industrial Liaisons, have had significant impact on the technical contributions of the research, have been instrumental in transferring the research results to industry, and are deeply committed to the education of the graduate students. The awards will be presented at the conference banquet on Monday evening.

Aristotle Award

The Aristotle Award was created by the SRC Board of Directors to recognize outstanding teaching in its broadest sense, emphasizing student advising and teaching during the research project. Criteria for receiving the Aristotle Award include innovation in student advising, provision of learning experiences for students through the research project, creation of an environment that encourages development of leadership skills, and student exposure to and interaction with industry. The Aristotle Award will be presented at the conference banquet on Monday evening.

Fellows and Scholars

The GRC Fellows and Scholars and the NRI Fellow are among the most promising students in US universities. They exemplify those qualities of dedication, intellectual curiosity, technical ability, motivation, and creativity that are required for productive university scientific and technical research. These young men and women bring significant talent, knowledge, professional interest and enthusiasm to the SRC research community. The Fellows and Scholars will be recognized at the conference banquet on Monday evening.

Posters from Undergraduate Research Opportunities Students

Students participating in the Undergraduate Research Opportunities (URO) program will again be a part of TECHCON. This program is in place on 16 university campuses with the objective of attracting a diverse population of qualified students and tracking them to graduate school. A poster section will be available in TechFair throughout the conference.

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