Session 19 - Interconnect/Dielectric Materials I (TECHCON 2016)

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Tuesday 13-Sep-2016 9:00 - 10:15 AM Sabine
Session 19 - Interconnect/Dielectric Materials I
19.1 9:00 AM GRC
Modeling Low-k SiCOH Reliability Statistics Based on Dielectric Spacing Variations

Sean P. Ogden (RPI)
19.2 9:15 AM GRC
Interconnect Technology Optimization Based on Circuit Performance of FINFET CMOS and Beyond

Divya Madapusi Srinivas Prasad (Georgia Tech)
19.3 9:30 AM GRC
Reduction in Surface Scattering in Copper by Graphene Deposition

Sunny Chugh (Purdue)
19.4 9:45 AM GRC
Electron Scattering at Rough Metal Surfaces: First-Principle Results

Tianji Zhou (RPI)
19.5 10:00 AM GRC
Sputtered Single Crystal Tungsten Nano-wires

Prabhu Doss Mani (Central Florida)

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