- Tuesday 13-Sep-2016 3:30 - 4:45 PM Pecos
- 32.1 3:30 PM GRC
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High Thermal Conductivity Packaging Materials Based on Functionalized PolymersJoseph Katz (Stanford, Intel Fnd/SRCEA Fellow)
- 32.2 3:45 PM GRC
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In-situ Modulus Estimation of Thin Films on Multilayer StacksTao Song (Purdue)
- 32.3 4:00 PM GRC
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Copper Nanofoam based Die-Attach Interconnections for High-power, High-temperature ApplicationsKashyap Mohan (Georgia Tech)
- 32.4 4:15 PM GRC
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Millimeter-Wave Characterization of 3D-Printed Dielectrics for Wireless Packaging SolutionsBijan K. Tehrani (Georgia Tech)
- 32.5 4:30 PM GRC
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Impact of Alternate Wiring Materials on Sequential Monolithic 3DICsWilliam Wahby (Georgia Tech, Intel Fnd/SRCEA Fellow)
- 32.6 TechFair 4 GRC
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Highly Scaled 3D Integration Enabled by Sub-Micron Through Silicon ViaReza Abbaspour (Georgia Tech)
