Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS) Workshop

Our increasing reliance on interconnected, intelligent devices and systems is paralleled by growing concerns about potential threats to security, which involves the entire stack starting with a “hardware root of trust.”  Diverse threats that may impact performance are posed by a variety of attackers with various motivations. These range from thieves who want to make money selling recycled chips as new to state-supported entities seeking to gain unauthorized access or control of national security systems. Attacks may target existing vulnerabilities or may entail tampering to modify functionality. The increase in use of third party design IP and the globalized supply chain lead to multiple points along the design and manufacture pathway where an attack may occur.

A challenge facing the industry is how to provide the level of assurance regarding security and trustworthiness required by the customer without unduly impacting performance or cost.  Trustworthy and Secure Semiconductors and Systems (T3S) supports the development of strategies, techniques and tools for the design and manufacture of chips and systems that are reliable, trustworthy, secure and resistant to attack or counterfeiting.  T3S addresses the root of the problem by funding basic university research that is fundamental to being able to provide assurance that hardware is trustworthy and secure.

T3S is an industry-led program; initial participants are AMD, Freescale, Intel and Mentor Graphics.  In the initial phase of research, T3S is partnering with the National Science Foundation (NSF) to jointly fund research in Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS) (http://www.nsf.gov/pubs/2014/nsf14528/nsf14528.htm)

This workshop is to refine and expand the research needs in this area, building on a workshop held in January 2013 (see link to report at /calendar/e004965/#tab-publications).  Experts from industry, government and academia will provide insights on challenges and strategies for addressing them.  The format will provide for active participation by all attendees, comprising three moderated panels with diverse perspectives and a final discussion on research needs.  An output will be a public report on research needs that will serve as input to future T3S solicitations.