ESH Review and (by invitation only) ESH Aspects of Semiconductor Manufacturing Research Needs and Opportunities Workshop

Workshop Summary

This document summarizes key workshop discussion points and potential research needs to address the identified challenges. 

Workshop Summary

Workshop Purpose

The purpose of the workshop is to provide a forum for device makers, chemical and equipment suppliers, and the university research community to discuss information and technology gaps, and identify research and technology development needs for 3 principal areas of concern. The goal is to help researchers target high-value research project proposals for the next round of SRC/ERC research, commencing in 2018. The workshops will focus on three areas:

• ESH aspects of chemicals used in lithography.

• ESH challenges in treatment of fab process wastewaters.

• The challenges of dealing with energetic compounds and prevention of uncontrolled reactions among highly reactive compounds in process tools and supply or exhaust systems.

The workshop program will consist of short presentations on the above topics by industrial members and other experts, followed by discussion and planning sessions.

Workshop Sessions:

PHOTOLITHOGRAPHY CHEMICALS

The workshop on photolithography chemicals will addresses the ESH challenges in formulating and using photolithography chemicals. Historically, one of the principal challenges has been with the perfluorinated alkyl substances used in photoacid generators (PAGs), surfactants, and resist polymers. Due to concerns with the persistence, bioaccumulative, and toxic (PBT) characteristics of some of these materials, the industry has successfully eliminated perfluorooctane sulfonate (PFOS), and is in the process of eliminating perfluorooctanoic acid (PFOA). However, an increasing array of other perfluoroalkyl and polyfluoralkyl substances (PFASs) are emerging as concerns, and steps are needed to understand their role in photolithography chemical formulations their occurrence in photolithography wastes and emissions, their PBT characteristics, and appropriate control technologies. More recently, concern has arisen regarding the potential PBT characteristics of the “onium” compounds (triphenylsulfonium, iodonium, and phosphonium) used in PAG formulations. Given the essential role of these materials, device makers and photolithography chemical suppliers have initiated a joint effort to identify the specific chemicals of concern, determine their PBT characteristics, and the extent to which they may be present in air emissions or wastewater discharges. In light of these concerns, the workshop on photolithography chemicals is intended to define the key ESH challenges in formulating and using photolithography chemicals; identify information and technology gaps; and the R&D that is needed to close the gaps and solve the challenges.

MITIGATION OF SEMICONDUCTOR EFFLUENTS & EMISSIONS

A second workshop session will address the challenges in mitigating problematic semiconductor effluents and emissions. Typically, a biological treatment process represents the final stage in the treatment of a fab wastewater prior to discharge to a receiving water body. Biological wastewater treatment processes (WWTP) have exceptional, but nonetheless finite capability to effectively decompose organic wastes, and it is important to know the chemical specific factors that limit their capability. Considerations that influence the capability of a biological WWTP to effectively treat a particular organic constituent may include; a) the potential inhibitory influence of the organic on the microbial biomass; b) the extent to which a biorefractory organic chemical is removed by the biomass; c) the extent to which the organic chemical may exert aquatic toxicity or have PBT characteristics; and d) the particular design and operating conditions of the biotreatment process. To the extent that a biological WWTP cannot effectively handle an organic chemical, a pretreatment process may be necessary to remove the contaminant(s) to acceptable discharge levels. However, there is often limited information regarding which pre-treatment processes are best suited for the removal of a given chemical. Pre-treatment processes such as advanced oxidation processes (AOP) sometimes form complex byproducts which are often difficult to measure and which in some cases may be as toxic as the initial target chemical. Important air emissions control topics include those associated with destroying fluorinated greenhouse gases and incineration of PFASs with minimal generation of CF4 and other byproducts. In light of these concerns, the workshop is intended to define the key challenges in mitigating wastewater effluents and emissions; identify information and technology gaps; and the R&D that is needed to close the gaps and solve the existing challenges.

ENERGETIC MATERIALS

A third workshop session will address the energetic materials used in semiconductor manufacturing. One of the key challenges lies with the use of reactive chemicals in CVD, ALD and related deposition and/or etch processes where significant amounts of partially reacted or unreacted precursor material may flow thru the process chamber and in certain cases may deposit or condense into post process piping systems. To the extent that these materials accumulate and have the potential to react violently, the risk must be characterized and mitigated. A 2013 SEMATECH study reported numerous reactive events that had occurred in post process systems, including pump forelines, vacuum pumps, exhaust lines and point-of-use abatement systems; and where a root-cause analysis indicated that the reactive incidents primarily involved condensed and deposited process by-product materials. SEMATECH developed an industry best practices document, that was intended to prevent such occurrences, and which is in the process of being developed as a SEMI standard. In light of these concerns, the energetic materials workshop is intended to define the key challenges posed by reactive materials in post chamber processing systems; identify information and technology gaps; and the R&D that is needed to close the gaps and solve the challenges

Hotel

Tucson University Park Hotel
880 East Second Street
Tucson, AZ 85719
Phone: (520) 792-4100
Fax (520) 903-9906

Group Name: E.R.C  Conference
Room Rate: $154.00/night (single/double occupancy) plus tax
Room Block Release Date: April 1, 2017

Online Hotel Reservation: Book your group rate for the ERC Review Conference

On-site reservation phone:   520-629-2819
On-site reservation contact: Natalia Farr
A ‘note’ to those dialing in:  if you get a ‘recording’ at the group reservations desk, make sure you leave a message and the reservations manager will call you back.

Transportation and Airport Information

Tucson International Airport - TUS (8 mi E) Take Tucson Blvd to Kino Pkwy; turn right on Kino to Broadway; turn left on Broadway to Euclid; turn right on Euclid to 2nd St.; turn right on 2nd St. Hotel is on the right; parking garage is on left.

Phoenix Sky Harbor International Airport - PHX (114 mi E) Take I-10 Southbound to Tucson; take Speedway exit, turn left (east) onto Speedway Blvd. Turn right on Euclid Avenue to Second Street. Turn left on Second Street. Hotel is at corner of Tyndall and Second Streets.

Other transportation and parking information is available upon request by sending an email to Karen McClure, On Site Coordinator.

Campus and Area Information

Information about Arizona can be found at the Arizona Office of Tourism.

These documents are for SRC member company representatives only.

This file provides information on all research tasks being reviewed in the order of the agenda. Please download to your hard drive for viewing.

Review Information eBook