Call for Research in Packaging 

• Overview
• Research Needs
• White Paper Guidelines
• Timetable and Deadlines

Overview

Semiconductor Research Corp. (SRC) Global Research Collaboration (GRC) is soliciting white papers in the research program of Packaging. The principal goal of this program is to advance fundamental knowledge and innovations to create and explore advanced evolutionary, revolutionary, and transformative packaging technologies for reliably encapsulating and efficiently integrating microsystems, and enabling them to interface to the macro world. This call, issued to universities worldwide, may be addressed by an individual investigator or a research team.

Our selection process is divided into two stages: The interested party is requested to submit a brief two-page white paper. The white paper should clearly identify what can be accomplished in a three-year project. A successfully selected white paper will result in an invitation to submit a full proposal. These proposals will be further down-selected for research contracts.

The number and size of the contracts awarded will be determined by the amount of available funds, and the number of high-quality proposals. The anticipated funding level per task is expected to be within $100K per year, which includes the overhead expenses charged by the institution. Contracts awarded normally support 1-2 graduate students. The funding level requested will be a factor in the selection process. Proposals offering funding leverage are strongly encouraged and should be indicated (further explained below). Due to the expected large number of submissions, we request that each researcher, as the leading investigator, is limited to two submissions.

Research Needs

Our research needs for this call generally fall into the following five categories:

1. Global Interconnects
2. Power Delivery
3. Thermal Management
4. Metrology, Modeling, Test, and Reliability
5. New Concepts

More details for each category can be found in the Research Needs document recently prepared by our Technical Advisory Board. This document summarizes and explains the relevant research topics in this call. We encourage submissions in these areas of high priorities which will be weighted more favorably, although submissions of all related topics will be considered for special insight and innovation.

White Paper Guidelines

White Papers are limited to 2 pages total, including figures and references, using a minimum of 10-point font size, and must be submitted via the SRC web-site by July 23, 2018 no later than 3PM EDT/ 12PM PDT. Submissions not in compliance with all guidelines will be excluded from consideration.

Please include the following identifying information in your White Paper: 

• Project title
• Investigator(s) and university
• Principal investigator’s contact information (telephone number, mailing address, and e-mail address)
• Category # (1-5) in Research Needs that most closely matches your proposed research

Please address the following topics in your White Paper:

• Objective and Results: What you plan to accomplish in a three-year plan? What are the anticipated outputs of a successful effort?
• Background: Identify area and problem to be addressed. Describe why research is being done. Rationalize value in terms of semiconductor industry needs.
• Approach: Present your strategy for addressing the problem. Describe important findings from your research to date. State the role of this research in advancing knowledge and state-of-the-art.
• Funding Request and participants: Plan for yearly budget should include overhead charges by your institution. Besides faculty, please also indicate the number of students supported and their degrees pursued. A detailed approved budget is not required at this time.
• Funding Leverage: Leverage amount applicable that is related and beneficial to the proposed work. Leverage includes other funding resources, subsidy, waived expenses and salaries, etc.
• Background IP: Identify any blocking pre-existing intellectual property on which new results will be based.

Contract Awardees will be expected to:

• Participate in annual project reviews (PIs and students).
• Participate in SRC's student conference, TECHCON (students).
• Interact with industry liaisons.
• Submit reports for pre-defined deliverables in proposal.
• Submit publications resulting from sponsored research.
• File patents when applicable.

Timetable and Deadlines

Please direct all technical questions to Kwok Ng (kwok.ng@src.org), thrust Director, (919)941-9417
All other questions and responses should be directed to Mary Altman, (919)941-9448.