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  • • The Analog Data Deluge
    • The Growth of Memory and Storage Demands
    • Communication Capacity vs. Data Generation
    • ICT Security Challenges
    • Compute Energy vs. Global Energy Production
    • Not Aligned
  Seismic Shift

• GRC Global Research Collaboration
  • All GRC Research

  • • 	All current thrusts/subthrusts
      	AMS-CSD	Analog/Mixed-Signal Circuits, Systems, and Devices
      	AIHW	Artificial Intelligence Hardware
      	CADT	Computer-Aided Design and Test Verification Test System, Logic, and Physical Design Functional Safety New Frontier for Scalable, Correctness-Assured Hardware Design
      	ESH	Environment, Safety, and Health
      	HWS	Hardware Security
      	LMD	Logic and Memory Devices Logic Devices and Modeling Memory Devices and Modeling
      	NMP	Nanomanufacturing Materials and Processes Patterning Front End Processes Back End Processes
      	PKG	Packaging

    Thrusts/Subthrusts

  • • 	All current centers
      	TxACE	Texas Analog Center of Excellence
      	CHIRP	Center for Heterogeneous Integration Research on Packaging
      	CDADIC	Center for Design of Analog-Digital Integrated Circuits

    Centers
  • • Select all current crosscuts
    • • 3D
      • Design for Manufacturability
      • Environment, Safety & Health
      • India Research Program
      • Interconnect
      • Longer Horizon Topics
      • Memory
      • Metrology
      • Mixed Signal
      • Modeling & Simulation
      • Multicore
      • Nanoengineered Materials
      • NSF/Secure and Trustworthy Cyberspace
      • NSF/SNB
      • NSF-SRC Initiative for Nanotechnology
      • Reliability
      • Software Research
      • SRC/NSF - Failure Resistant Systems
    Crosscuts

  • • 	CADTS	Computer Aided Design & Test Sciences 1999–2014
      	CSR	Cross-disciplinary Semiconductor Research 1999–2014
      	DES	Design Sciences 1982–1998
      	DS	Device Sciences 2004–2014
      	ES-H	Environmental Safety & Health Sciences 1995–1998
      	FAC	Factory Sciences 1995–1998
      	ICSS	Integrated Circuit & Systems Sciences 1999–2014
      	IPS	Interconnect & Packaging Sciences 2004–2014
      	INT	Interconnect Sciences 1995–1998
      	LIT	Lithography Sciences 1993–1998
      	MFGPS	Manufacturing Process Sciences 1988–1994
      	MSS	Manufacturing Systems Sciences 1988–1994
      	MPS	Material & Process Sciences 1999–2003
      	MBP	Materials & Bulk Processes Sciences 1995–1998
      	MIC	Microstructure Sciences 1982–1994
      	NMS	Nanomanufacturing Sciences 2004–2014
      	NIS	Nanostructure & Integration Sciences 1999–2003
      	PKG	Packaging Sciences 1985–1998
      	PID	Process Integration & Device Sciences 1995–1998
      	SMS	Semiconductor Modeling & Simulation 1995–1998

    Historical Science Areas

  • • 		Advanced Devices 1994–1995
      		Advanced Devices & Technologies 1999–2003
      		Advanced Devices & Technologies 2004–2004
      	AdvTech	Advanced Technology 1994–1996
      	ADS	Alternative Device Structures 1996–1998
      	AMS	Analog and Mixed-Signal Devices 2004–2014
      		Analysis, Design & Simulation 1994–1995
      		Back End Processes 1999–2003
      	BEP	Back End Processes 2004–2014
      	CFM&TCM	CFM & Total Chemical Management 1995–1998
      	CD	Circuit Design 1999–2014
      	CM	Compact Modeling 2004–2014
      		Contamination Control 1994–1995
      	C&S	Controls and Sensing 1996–1998
      	CSR	Cross-Disciplinary Semiconductor Research 2015–2016
      		Defect Reduction 1997–1998
      		Deposition 1994–1995
      	DE	Design Environment 1994–1998
      	DesSyn	Design Synthesis 1994–1998
      	DesTech	Design Techniques 1994–1998
      	DV	Design Verification 1994–1998
      	DSMS	Device Sciences Modeling & Simulation 2004–2014
      	DCMOS	Digital CMOS Technologies 2004–2014
      		Doping Technologies 1996–1998
      	EP3C	Efficiency and Performance for Connectivity Constrained Computing 2014–2019
      	ESH	Environment, Safety, and Health 1995–1998
      	ESH	Environment, Safety, and Health 1999–2003
      	ESH	Environment, Safety, and Health 2004–2014
      		Equip. Auto. and Process Control 1994–1995
      	Equip	Equipment 1996–1998
      	FAM	Factory Automation & Management 1994–1998
      	FacOps	Factory Operations 1997–1998
      		Factory Systems 1999–2003
      	FACSYS	Factory Systems 2004–2010
      	FEOL	FEOL Processes 1996–1998
      		Front End Processes 2004–2004
      		Heat, Signal, & Power Distribution 1994–1995
      	I3T	Innovative and Intelligent Integrated Technology 2014–2020
      	ISD	Integrated System Design 1994–2014
      		Lithography 1994–1995
      	LPD	Logic & Physical Design 2004–2014
      		Logic Design 2000–2004
      		Masks 1995–1998
      		Materials 1995–1998
      		Materials & Measurements 1994–1995
      	MT	Memory Technologies 2004–2014
      		Metrology 1994–1998
      	MTMP	Metrology Tools, Matls & Processes 1996–1998
      		Modeling & Simulation 1995–1998
      		Modeling & TCAD 1996–1998
      		Multi-level Interconnect 1994–1995
      	NEM	Nanoengineered Materials 2006–2014
      	NCR	Non-Classical CMOS Research 2008–2011
      		Package & Electrical Design 1996–1998
      		Package Reliability 1994–1995
      	PKG	Packaging 2004–2014
      		Packaging & Interconnect Systems 1999–2003
      	PMM	Packaging Materials and Metrology 1995–1998
      		Packaging Materials Interfaces 1998–1998
      	PMS	Packaging Modeling and Simulation 1998–1998
      	Pat(MPS)	Patterning 1999–2003
      	PAT	Patterning 2004–2014
      	PatMat	Patterning Materials 1996–1998
      	PatSys	Patterning Systems 1996–1998
      	PhyDes	Physical Design 1994–1998
      		Physical Design 1999–2004
      		Plasma Etch 1994–1995
      		Process Architecture 1996–1998
      	PS/E	Process Simplification/Enhancements 1995–1998
      	Processes	Processes 1996–1998
      		Quality & Reliability 1996–1998
      		Reliability 1994–1998
      		Resist 1996–1998
      		Semiconductor Modeling & Simulation 1999–2001
      	SemiSynBio	Semiconductor Synthetic Biology 2013–2021
      		Substrates 1995–1998
      		Synthesis & Verification 1999–2000
      	SLD	System Level Design 2015–2019
      		TCAD-MBPS 1996–1998
      	TechCAD	Technology CAD 1994–1996
      	TT	Test & Testability 1994–1998
      	TT	Test & Testability 1999–2014
      	TM	Thermal Management 1996–1998
      	VER	Verification 2000–2014

    Historical Thrusts

  • • 	ACE4S	ATIC-SRC Center of Excellence for Energy Efficient Electronics Systems 2013–2018
      	CAIST	The New York Center for Advanced Interconnect Science and Technology 2005–2016
      	CEMPI	Center for Electronic Materials Processing and Integration 2010–2014
      	EBSM	SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 1996–2021
      	NCRC	Non-classical CMOS Research Center 2006–2014
      	IPC	Georgia Tech Interconnect and Packaging Center 2009–2012

    Historical Centers
• JUMP2 Joint University Microelectronics Program 2.0
  • All JUMP2 Research

  • • 	All current centers
      	COCOSYS	COCOSYS: Center for the Co-Design of Cognitive Systems Neural, Symbolic and Probabilistic Algorithms Hardware-Algorithm Co-Design Technology-driven Hardware Motifs Collaborative Intelligence
      	CUBIC	CUBIC: Center for Ubiquitous Connectivity Connectivity Networks and Systems Wireline and Lightwave Interconnects Wireless Circuits and Technology
      	COGNISENSE	COGNISENSE: Center on Cognitive Multispectral Sensors Multi-spectral Array Analog-to-Insight Closed-Loop Attention Control Heterogeneous System Integration System Software and Integration
      	ACE	ACE: Evolvable Computing for Next-Generation Distributed Computer Systems Heterogeneous Computing Platforms Distributed Evolvable Memory and Storage Fine-grained Communication and Coordination Security, Privacy, and Correctness Demonstrators
      	PRISM	PRISM: Center for Processing with Intelligent Storage and Memory Systems and Software Architecture Devices and Circuits Grand Challenges
      	CHIMES	CHIMES: Center for Heterogeneous Integration of Micro Electronic Systems System Driven Functional Integration and Aggregation Monolithic 3D (M3D) Densification and Diversification on Silicon Platform Ultra Dense Heterogeneous Interconnect and Assembly Materials Behavior, Synthesis, Metrology, and Reliability
      	SUPREME	SUPREME: Superior Energy-efficient Materials and Devices Digital and Analog Memory and Applications Interconnects and Metrology Materials Discovery and Processing

    Centers & Themes