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P1932

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JUMP

Methods of Forming Stacked Integrated Circuits using Selective Thermal Atomic Layer Deposition on Conductive Contacts and Structures Formed using The Same

Muhannad S. Bakir (Georgia Tech); Michael C. Breeden (UC/San Diego); Jonathan Hollin (Wayne State); Andrew Kummel (UC/San Diego); Ming Jui Li (Georgia Tech); Nyi Myat Khine Linn (Wayne State); Victor Wang (UC/San Diego); Charles H. Winter (Wayne State)
Patent Issued (on 2-Jul-2024)
Application Type: Utility

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Methods of Forming Stacked Integrated Circuits using Selective Thermal Atomic Layer Deposition on Conductive Contacts and Structures Formed using The Same

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