Oxidation Resistant High Conductivity Copper Layers for Microelectric Applications and Process of Making Same

• Application Type:

  Utility

  Patent Number:

  5622608

  Country:

  United States

  Status:

  Filed on 4-May-1994, Issued on 22-Apr-1997, Patent Abandoned

  Organization:

  University at Albany - SUNY

  SRC Filing ID:

  P0007

Inventors

• William A. Lanford (SUNY Albany)
• Peijun Ding (SUNY Albany)