Methods of Forming Features of Integrated Circuits Using Modified Buried Layers and Integrated Circuits Having Features so Formed

• Application Type:

  Utility

  Patent Number:

  6346446

  Country:

  United States

  Status:

  Filed on 24-May-2000, Issued on 12-Feb-2002, Patent Abandoned

  Organization:

  Massachusetts Institute of Technology

  SRC Filing ID:

  P0190

Inventor

• Andrew P. Ritenour (MIT)