Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same

• Application Type:

  Utility

  Patent Number:

  6919639

  Country:

  United States

  Status:

  Filed on 15-Oct-2002, Issued on 19-Jul-2005, Patent Abandoned

  Organization:

  University of Texas at Austin

  SRC Filing ID:

  P0268

Inventors

• Ki-Don Lee (UT/Austin)
• Hideki Matsuhashi (UT/Austin)
• Paul S. Ho (UT/Austin)
• Ennis T. Ogawa (UT/Austin)