Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication

• Application Type:

  Continuation

  Patent Number:

  6788867

  Country:

  United States

  Status:

  Filed on 11-Dec-2003, Issued on 7-Sep-2004, Patent Abandoned

  Organization:

  Georgia Institute of Technology

  SRC Filing ID:

  P0442

Inventors

• Tony Victor Mule (Georgia Tech)
• James D. Meindl (Georgia Tech)
• Muhannad S. Bakir (Georgia Tech)
• Paul A. Kohl (Georgia Tech)
• Stephen M. Schultz (BYU)
• Thomas K. Gaylord (Georgia Tech)
• Elias N. Glytsis (Georgia Tech)
• Ricardo Villalaz (Georgia Tech)