Multiple Copper Vias for Intergrated Circuit Metallization

• Application Type:

  Continuation

  Patent Number:

  7078817

  Country:

  United States

  Status:

  Filed on 13-Dec-2004, Issued on 18-Jul-2006, Patent Abandoned

  Organization:

  University of Texas at Austin

  SRC Filing ID:

  P0521

Inventors

• Hideki Matsuhashi (PDF Solutions)
• Paul S. Ho (UT/Austin)
• Ki-Don Lee (TI)
• Ennis T. Ogawa (TI)