Density Multiplication and Improved Lithography by Directed Block Copolymer Assembly

    • Application Type:
      Utility
      Patent Number:
      9183870
      Country:
      United States
      Status:
      Filed on 5-Dec-2008, Issued on 10-Nov-2015, Patent Abandoned
      Organization:
      University of Wisconsin - Madison
      SRC Filing ID:
      P1116

    Inventors

    • Paul Nealey (U of Wisconsin/Madison)
    • Huiman Kang (U of Wisconsin/Madison)
    • Francois Detcheverry (U of Wisconsin/Madison)
    • Juan de Pablo (U of Wisconsin/Madison)
    • Ricardo Ruiz (Hitachi Ltd.)
    • Thomas Albrecht (Hitachi Ltd.)

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