Non-Invasive Pre-Bond TSV TestUsing Ring Oscillators and Multiple Voltage Levels
Inventors
- Sergej Deutsch (Duke)
- Krishnendu Chakrabarty (Duke)
Related Patents
Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple Voltage Levels
Krishnendu Chakrabarty (Duke); Sergej Deutsch (Duke)Patent Issued (on 15-Oct-2019)
Application Type: Continuation