Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same

    • Application Type:
      Utility
      Patent Number:
      10090150
      Country:
      United States
      Status:
      Filed on 6-Sep-2017, Issued on 2-Oct-2018
      Organization:
      University of Wisconsin - Madison
      SRC Filing ID:
      P1731

    Inventors

    • Xiangyu Guo (U of Wisconsin/Madison)
    • J. Leon Shohet (U of Wisconsin/Madison)
    • Huifeng Zheng (Lam Research)
    • Dongfei Pei (GlobalFoundries)
    • Joshua M. Blatz (U of Wisconsin/Madison)
    • Weiyi Li (U of Wisconsin/Madison)

    Related Patents

    P1633
    Application Expired
    GRC

    Curing Process for low dielectric constant interlayer dielectrics

    Joshua M. Blatz (U of Wisconsin/Madison); Xiangyu Guo (U of Wisconsin/Madison); Weiyi Li (U of Wisconsin/Madison); Dongfei Pei (GlobalFoundries); J. Leon Shohet (U of Wisconsin/Madison); Huifeng Zheng (Lam Research)
    Patent Application Expired
    Application Type: Provisional

    INFORMATION

    FOR MEMBERS

    SRC VALUE

    ACADEMIA

    4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

    © 2024 by Semiconductor Research Corporation ®
    Access to information on this website may be limited to member companies,
    participating agencies, and qualified researchers.

    Important Information for the SRC website. This site uses cookies to store information on your computer. By continuing to use our site, you consent to our cookies. If you are not happy with the use of these cookies, please review our Cookie Policy to learn how they can be disabled. By disabling cookies, some features of the site will not work.