Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same
Inventors
- Xiangyu Guo (U of Wisconsin/Madison)
- J. Leon Shohet (U of Wisconsin/Madison)
- Huifeng Zheng (Lam Research)
- Dongfei Pei (GlobalFoundries)
- Joshua M. Blatz (U of Wisconsin/Madison)
- Weiyi Li (U of Wisconsin/Madison)
Related Patents
Curing Process for low dielectric constant interlayer dielectrics
Joshua M. Blatz (U of Wisconsin/Madison); Xiangyu Guo (U of Wisconsin/Madison); Weiyi Li (U of Wisconsin/Madison); Dongfei Pei (GlobalFoundries); J. Leon Shohet (U of Wisconsin/Madison); Huifeng Zheng (Lam Research)Patent Application Expired
Application Type: Provisional