Converting Ta- and Ti-Based Cu Diffusion Barriers into their sp2 Bond Based 2D Materials to Enhance Diffusion Barrier Properties with Atomically-thin Thickness

• Application Type:

  Utility

  Patent Number:

  11289423

  Country:

  United States

  Status:

  Filed on 11-Jun-2019, Issued on 29-Mar-2022

  Organization:

  Purdue University

  SRC Filing ID:

  P1824

Inventors

• Zhihong Chen (Purdue)
• Chun-Li Lo (Purdue)