Study of Bimetallic Corrosion for Cu Interconnect and IC Packaging Using Micro-Pattern Corrosion Screening
Aluminum bond pad corrosion activity and mechanistic insight at a Cu/Al bimetallic interface used in microelectronic packages for automotive applications is investigated by means of Microscopy, EDX and Electrochemistry. Impact of copper on aluminum corrosion was explored by copper micro-pattern screening technique and reveals three important findings that can provide mechanistic understanding for operational corrosion prevention: 1). Corrosion is activated on the Al/Cu bimetallic interface 2). The corrosion rate with Al/Cu bimetallic was much higher compared with bare aluminum. 3). Observed hydrogen gas evolution play a key role in Cu-Al bimetallic corrosion.
Sunday, Sept. 20, 2015, 8 a.m. — Tuesday, Sept. 22, 2015, 10 p.m. CT
Austin, TX, United States
Technical conference and networking event for SRC members and students.