Integration and Packaging Strategies for Millimeter-Wave CMOS
Millimeter-wave CMOS circuits are being developed for consumer products operating up to 100 GHz and beyond. Applications range from 77 GHz automotive radar to spectrometers for gas analysis operating from 200 to 300 GHz. High data rate communication systems for wireless and wireline applications take advantage of the wide bandwidth available at millimeter-wave frequencies. While the design of active components and sub-circuits has been explored by many, there still is the need to provide integration and packaging strategies that remain low in cost and high in performance.
This presentation will cover results related to the design of antennas and integration techniques for a CMOS-based spectrometer. Multilayer techniques using benzocyclobutene (BCB) and SU8 photoresist have been used to support an aperture bow tie antenna. The material properties of some materials has been studied using microstrip ring resonators up to 220 GHz and FTIR up to 75 THz. Results from antennas and power divider circuits designed on FR4 substrates will also be presented.
|Integration and Packaging Strategies for Millimeter-wave CMOS|
Friday, Feb. 24, 2017, 2 p.m.–3 p.m. ET
Durham, NC, United States