Design of Flexible Interconnect IPs for System-In-Package Architectures
This annual report outlines research accomplishments and plans for future work.
May 2017–June 2017
|2017 System Level Design Review|
Wednesday, May 31, 2017, 8 a.m. — Thursday, June 1, 2017, 5 p.m. ET
Ann Arbor, MI, United States