Final Report on Effect of Moisture Conditioning and Thermal Aging on EMC/Copper Interfacial Fracture Energy and the Cohesive Zone Parameters
Research Report Highlight
This report extracts modified cohesive zone parameters through experiments and simulations for EMC/copper interfaces both before and after being subjected to moisture conditioning and thermal aging profiles.
This report provides modified cohesive zone parameters through experiments and simulations for EMC/copper interface that is subjected to moisture conditioning and thermal aging profiles and compares these modified cohesive zone parameters against the cohesive zone parameters for pristine CMC/copper interface. In particular:
1. The critical SERR (Gc) of EMC/Copper pristine interface is first determined by conducting interfacial fracture experiments. These experiments include double cantilever beam test and four-point bend test.
2. From the load versus displacement experimental data of the interfacial fracture experiments, Gc can be calculated through FEM and analytical calculations. The variation of Gc as a function of mode mixity is then determined.
3. Using load vs. displacement experimental data as well as Gc variation as a function of mode mixity, the cohesive zone parameters are then determined for as-received or pristine EMC/copper interface.
4. EMC/Copper specimens will then be subjected to different humidity conditioning and thermal aging profiles, and the interfacial fracture mechanics experiments are then repeated at room temperature.
5. As discussed in Step #2 and #3, modified CZ parameters are then determined for humidity- and temperature-conditioned EMC/Copper samples.
6. The modified CZ parameters for conditioned samples are compared against the CZ parameters for as-received pristine samples, and a discussion is provided as to effect of humidity and temperature conditioning on CZ parameters.