High Thermal Conductivity Packaging Materials Based on Functionalized Polymers

  • Authors:
    Joseph Katz (Stanford), Mehdi Asheghi-Roudheni (Stanford), Yan Xia (Stanford), Kenneth E. Goodson (Stanford), Yew Chin Teo (Stanford), Holden Lai (Stanford)
    Publication ID:
    P091082
    Publication Type:
    Annual Review
    Received Date:
    6-Jun-2017
    Last Edit Date:
    20-Jun-2017
    Research:
    2666.001 (Stanford University)

Abstract

Thermal conductivity of polymer composites is of critical importance in electronics packaging for both lifetime and performance. Typically, engineers add inorganic fillers to organic composites to achieve increased thermal conductivity over an intrinsic polymer matrix while making sacrifices in other properties. Here, we demonstrate the synthesis and thermal characterization of novel intrinsic polymers that aim to increase the thermal conductivity of the polymer matrix. One type is a rigid "ladder" polymer with two parallel backbones rather than a single line of monomers. The other is a highly branching "brush" polymer that aims to increase the number of intermolecular interactions per unit volume, facilitating heat transfer. We use the 3w method, a common thin film thermal characterization technique, to characterize the thermal conductivity of sample films. The preliminary measurements indicate results typical of polymers in the through-plane direction, though further work is required to verify these results and determine in-plane characteristics.

Past Events

  Event Summary
13 June 2017
GRC
GRC
Packaging Review
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States

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