Fatigue Effects on Cohesive Zone Parameters for Mold Compound/Leadframe Interface
This annual review presentation highlights the progress made regarding fatigue characterization and modeling for epoxy molding compound to copper interfaces. In particular Paris law results updates and full 3D ANSYS models are highlighted. New experiments are also discussed in the context of obtaining the required information to model fatigue crack propagation with CZM for any geometry or mechanical loading conditions.
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States