Thermal Aging and Moisture Thermal Aging and Moisture Conditioning Effects on Cohesive Zone Parameters for Mold Compound/Leadframe Interface

  • Authors:
    Abhishek Kwatra (Georgia Tech), V. N. N. Trilochan Rambhatla (Georgia Tech), William Krieger (Georgia Tech), David Samet (Georgia Tech), Suresh Sitaraman (Georgia Tech)
    Publication ID:
    P091104
    Publication Type:
    Annual Review
    Received Date:
    12-Jun-2017
    Last Edit Date:
    20-Jun-2017
    Research:
    2392.001 (Georgia Institute of Technology)

Abstract

This annual review concludes the program in which modified cohesive zone parameters through experiments and simulations for EMC/copper interface that is subjected to moisture conditioning and thermal aging profiles and compares these modified cohesive zone parameters against the cohesive zone parameters for pristine CMC/copper interface.

Past Events

  Event Summary
13 June 2017
GRC
GRC
Packaging Review
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States

4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

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