Thermal Aging and Moisture Thermal Aging and Moisture Conditioning Effects on Cohesive Zone Parameters for Mold Compound/Leadframe Interface
This annual review concludes the program in which modified cohesive zone parameters through experiments and simulations for EMC/copper interface that is subjected to moisture conditioning and thermal aging profiles and compares these modified cohesive zone parameters against the cohesive zone parameters for pristine CMC/copper interface.
Tuesday, June 13, 2017, 8 a.m.–5 p.m. ET
Atlanta, GA, United States