Self-aligned DSA of Multi-color Manufacturing-relevant Patterns

  • Authors:
    Moshe Dolejsi (Univ. of Chicago), Chun Zhou (Univ. of Chicago), Cody Bezik (Univ. of Chicago), Grant P. Garner (Univ. of Chicago), Paul Nealey (Univ. of Chicago), Juan de Pablo (Univ. of Chicago)
    Publication ID:
    P091148
    Publication Type:
    Annual Review
    Received Date:
    21-Jun-2017
    Last Edit Date:
    26-Jun-2017
    Research:
    2673.001 (University of Chicago)

Abstract

Effects of chemistry on the directed-self assembly hole shrink process have been studied using both experimental and computational techniques. It was discovered that kinetic control can be used to preferentially functionalize the hole sidewall over the bottom. It is further shown that the sidewall chemistry is far more important for successful hole-shrink than the bottom chemistry. TEM Tomography is demonstrated as a comprehensive 3D metrology technique for hole shrink on 300 mm wafers processed on track. Using string methods, the free energy path of cylinder formation is studied to determine processing parameters that result in the formations of cylinders without any metastable transition states. Kinetic control is also shown to be applicable to the metal/dielectric system, in particular when the metal is copper or copper oxide.

Past Events

  Event Summary
27–28 June 2017
GRC
GRC
Nanomanufacturing Materials and Processes (NMP) Review
Tuesday, June 27, 2017, 8 a.m. — Wednesday, June 28, 2017, 5 p.m. PT
Stanford, CA, United States

4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

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