Self-aligned DSA of Multi-color Manufacturing-relevant Patterns
Effects of chemistry on the directed-self assembly hole shrink process have been studied using both experimental and computational techniques. It was discovered that kinetic control can be used to preferentially functionalize the hole sidewall over the bottom. It is further shown that the sidewall chemistry is far more important for successful hole-shrink than the bottom chemistry. TEM Tomography is demonstrated as a comprehensive 3D metrology technique for hole shrink on 300 mm wafers processed on track. Using string methods, the free energy path of cylinder formation is studied to determine processing parameters that result in the formations of cylinders without any metastable transition states. Kinetic control is also shown to be applicable to the metal/dielectric system, in particular when the metal is copper or copper oxide.
|Nanomanufacturing Materials and Processes (NMP) Review|
Tuesday, June 27, 2017, 8 a.m. — Wednesday, June 28, 2017, 5 p.m. PT
Stanford, CA, United States