Thermal Characterization of Ladder Polymers and Other Intrinsic Polymers

  • Authors:
    Joseph Katz (Stanford), Holden Lai (Stanford), Yew Chin Teo (Stanford), Mehdi Asheghi-Roudheni (Stanford), Yan Xia (Stanford), Kenneth E. Goodson (Stanford)
    Publication ID:
    P091186
    Publication Type:
    Deliverable Report
    Received Date:
    28-Jun-2017
    Last Edit Date:
    29-Jun-2017
    Research:
    2666.001 (Stanford University)

Abstract

Thermal management is exceptionally important in electronics packaging considerations for both device performance and lifetime. Polymers are typically the matrix of composites for electronics packaging due to their mechanical and dielectric properties, but they tend to be thermally limiting. Much development has led to composites with enhanced thermal conductivity through the addition of thermally conductive fillers to a weakly thermally conductive polymer matrix; however, recent research has shown incredible potential for high thermal conductivity intrinsic polymers. Here, we report on the measurements of novel intrinsic polymers, including rigid ladder polymers with two parallel backbones on a single molecule, and highly branching “bottle brush” polymers with long side chains. We use the 3w method to determine the thermal conductivity of the sample films. The ladder polymer film is found to have a thermal conductivity of 0.143 Wm-1K-1, and the brush polymer is found to have a thermal conductivity of 0.15 Wm-1K-1. These material systems present exciting platforms to modify important parameters in ongoing systematic studies of the physical phenomena governing thermal conductivity in polymers.

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