Molecular Level Studies on Buried Interfaces Related to Packaging

  • Authors:
    Nathan Ulrich (Univ. of Michigan), John Andre (Univ. of Michigan), Jaimal Williamson (TI), Zhan Chen (Univ. of Michigan)
    Publication ID:
    P091309
    Publication Type:
    Paper
    Received Date:
    10-Jul-2017
    Last Edit Date:
    12-Jul-2017
    Research:
    2662.001 (University of Michigan)

Abstract

Adhesion is incredibly important in the microelectronics industry and it is very difficult to study. There are many different surfaces that must be connected by adhesives, which makes a suitable adhesive difficult to design. Adhesion research focuses on improving the strength and understanding the mechanisms that are involved. Methods of increasing adhesion include the use of silane adhesion promoters (SAPs) and plasma treatment of surfaces. This research investigated molecular mechanisms of adhesion enhancement by these two methods, in situ, at buried interfaces. It was found that silanes migrate to the buried polymer/adhesive interface and can cause changes at the interface that increase adhesion. Plasma was found to disorder the interface, which then increased the adhesion. Systems were also subjected to hygrothermal treatment and it was found that moisture moves to the interface to decrease the adhesion but this can be prevented by SAPs.

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