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TECHCON 2018 Proceedings
Find TECHCON 2018 papers and presentations, student presenters, award winners and more!
Article
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Professors Honored for Excellence in Semiconductor Research
Semiconductor Industry Association (SIA) announce 2018 University Research Award winners
Press Release
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New material could improve efficiency of computer processing and memory
C-SPIN researchers demonstrate a topological insulator that challenges conventional wisdom
Article
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Special Poster Session Highlighting SRC Student Innovation
This all-student poster session showcase at IEDM highlights fundamental semiconductor research in universities worldwide, sponsored by industry members and government agencies. The Semiconductor Research Corporation (SRC) drives advances in materials, devices, processing, metrology, and modeling that are all well-aligned to IEDM’s future.
Article
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$26 Million in New Research Funds
JUMP will fund 24 additional research projects spanning 14 unique U.S. universities.
SRC In The News
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SRC JUMP Center CRISP Research Featured in ACM SIGARCH Computer Architecture Today
Easy Persistent Memory Performance Wins
SRC In The News
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CRISP Researcher featured in ACM SIGARCH
Intelligent memory architecture with new memory technologies
SRC In The News
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STARnet, CSPIN Research Featured in Nature Communications
The research describes a fourth ferromagnetic element with magnetic properties at room temperature
Article
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SRC Colloquium on Fabrics of Security
Broaden the scope of industrial and government engagement in fabrics of security to include hardware, architecture, system, network and cloud centric participants.
Article
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JUMP's ComSenTer research featured in IEEE Spectrum
5G may not be here yet. That doesn't stop what comes next.
Article
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One-dimensional quantum materials can deliver record-high current densities
SRC Prof. Alexander Balandin discovered that quasi-1D ZrTe3 nanoribbons reveal an exceptionally high current density, on the order of ∼100 MA/cm2, at the peak of the stressing DC current.
Article
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Researchers developed a novel prevention treatment for Al bond pad corrosion in Cu wire bonded assembly.
NMP Featured Publication: Final Report on Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding Reliability
Featured Publication
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A metric is defined which quantifies a gate-level IP's trustworthiness by evaluating functional, structural and asset coverage.
T3S Featured Publication: Report on Dynamic Trust Benchmarks and Comprehensive IP Trust Metrics
Featured Publication
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Fundamental studies demonstrate that BTA is highly effective at preventing Al bond pad corrosion in acidic Cl condition.
PKG Featured Publication: Report on Design/Prepare New Corrosion Inhibitors
Featured Publication
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