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SRC's website to be offline again on Saturday.
SRC's will be doing firmware upgrades from 8 a.m. to 2 p.m. ET on 11/17.
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CADTS Featured Publication: 3D design optimization ...
New 3D design optimization reduces cost by 19% for TSV-based designs and 26% for interposer-based designs.
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CADTS Featured Publication: Multicore design software ...
New software for multicore design targets faulty functional units, processor resiliency, and cache coherence.
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IPS Featured Publication: Low-k charge trapping ...
A model provides for the 1st time a clear physical description of charge trapping dynamics in low-k materials.
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IPS Featured Publication: Pb-free reliability ...
A new predictive reliability model for Pb-free, Sn-based solder joints and μ-bumps was developed and verified.
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NMS Featured Publication: Laser PEB ...
Laser PEB enables new class of low molecular weight MGs as potential photoresists.
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DS Featured Publication: Analog performance of FinFETSs ...
Analog performance of FinFETs is shown to be superior to that of bulk devices in standard digital CMOS.
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2013 Simon Karecki Award - Nominations Now Being Accepted
Nominations for the 2013 Simon Karecki Award will be accepted starting November 1. The deadline for submitting nominations is December 3, 2012.
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ATIC Research Grants with SRC Drive UAE Technology Innovation
Over AED 100 million committed from ATIC towards UAE research to date
SRC In The News
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NRI to Lead New Five-Year Effort to Develop Post-CMOS Electronics
The new award will extend the current five-year collaboration between NRI and NIST.
SRC In The News
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ICSS Featured Publication
Automatic generation of post-silicon validation now has 4X better coverage and runs a million times faster.
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CADTS Featured Publication
Experiments with large lots of industrial parts show potential for burn-in reduction and cost saving.
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IPS Featured Publication
A new understanding of intrinsic and metal induced failure mechanisms in ultra low-k films was developed.
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DS Featured Publication
Aspect ratio trapping for InGaAs epi on Si using nanoscale trenches yields 3 orders reduction in dislocations.
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SRC and Cornell Introduce Lithographic Breakthrough with Laser Spike Anneal to Create Higher Fidelity Circuit Patterns
Millisecond Transient Laser Anneal Outperforms State-of-Art Hotplate Bake for Both 193-Nanometer and EUV Lithography Applications
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