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Simulation with ADL model gives 90% timing and energy cycle-accurate results running up to 1800 MIPS.
ICSS Featured Publication: Automated, ADL-Driven Generation of Host-Compiled Platform Models
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Novel post-silicon validation techniques double bug coverage and show huge latency improvement.
CADTS Featured Publication: Technical Report on an Overview of Bug Benchmarks
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20x power reduction seen on examples of IP blocks translated to low power asynchronous implementations.
CADTS Featured Publication: Clocked and Asynchronous Design, Translation, Evaluation, CAD Software, and Verilog Code for 3-4 of the Following Blocks: Modular OCP Interface, FFT, SPI, UART, I2C and I2S
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Radu Marculescu Wins Most Influential Paper Award
Radu Marculescu Wins Most Influential Paper Award
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System-level analysis of FinFET processors can now include power, delay, and PVT variations.
ICSS Featured Publication: McPAT-PVT: Delay and Power Modeling Framework for FinFET Processor Architectures under PVT Variations
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First sub-nanometer 3D imaging demonstrated using STEM through-focal tomography.
NMS Featured Publication: Report on the Effectiveness of Electron Tomography for the Chemical Imaging of Devices at the Nanoscale
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Researchers showed newly developed code to simulate transient diffusion was 24x faster than commercial code.
DS Featured Publication: Accelerated Kinetic Monte Carlo Algorithm for Off-Lattice Particle-Based Reaction-Diffusion Systems
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4.2X inductance and 5X Q-factor increases achieved for on-chip inductors with peak-Q occurring at up to 1GHz.
IPS Featured Publication: Lamination and Patterning Effects on Inductor Performance
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SRC Researcher Elected as a Fellow of the Indian National Academy of Engineering
The Academy honors Indian and Foreign nationals who are elected by "peer" committees in recognition of their personal achievements in "Engineering" which are of exceptional merit and demonstrated distinctive eminence in the new and developing fields of technology.
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University of Illinois-led SONIC Center Awarded $30 Million for Computing on Nanoscale Fabrics
Led by faculty at the University of Illinois at Urbana-Champaign, a multi-university research team has received $30 million to launch the Systems On Nanoscale Information fabriCs (SONIC) Center.
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University of Minnesota Awarded $29 Million Grant to Lead Development of Next-generation Microelectronics
New center is one of only six in the nation aimed at supporting the U.S. semiconductor industry
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UC Berkeley-Led Team Awarded $27.5M for New TerraSwarm Research Center
Researchers at UC Berkeley's Electrical Engineering and Computer Science (EECS) department are spearheading a multi-university team that is being awarded $27.5M for the new TerraSwarm Research Center
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Notre Dame to be Part of $194 Million University Research Center Network Focused on Next-generation Microelectronics
The University of Notre Dame has been selected to join the new STARnet program.
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New Semiconductor Research Center Established at UCLA Engineering Center will Explore New Materials and Atomic-scale Structures for More Powerful and Energy-efficient Semiconductor Components
UCLA has been selected to join the new STARnet program.
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SRC, DARPA Unveil $194 Million University Research Center Network Focused on Next-Generation Microelectronics
New STARnet Program Features Six Research Centers
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