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David Allstot Receives Mac Van Valkenburg Award
The IEEE Circuits and Systems Society has announced that David Allstot of University of Washington has received the 2011 Mac Van Valkenburg Award for “For contributions to mixed-signal and RF integrated systems.”
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SRC Drives Key Initiatives to Accelerate Industry Adoption of 3D Integration of Integrated Circuits and Systems
Programs to Address Critical Reliability and Design Tools Connected to Industry 3D Integration Effort
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NMS Featured Publication
Designed additives enhance and may extend EUV resist performance
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IPS Featured Publication
A novel method to continuously monitor for pending solder interconnect failures has been developed
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CADTS Featured Publication
A new design-dependent process monitoring strategy can improve profit per chip by up to 6% of selling price
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NMS Featured Publication
Virtual toxicity screening has been demonstrated for a designed library of 240K functionalized CNT molecules
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IPS Featured Publication
A neural network-based predictive model for transient shock-based interconnect failures has been developed
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CADTS Featured Publication
Distributed temporal redundancy may improve IC system reliability by 11%
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Carnegie Mellon Student Work Showcased at Undergraduate Research Symposium
URO students will compete for 18 awards
SRC In The News
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On SRC's website, the Research Catalog page has been improved
We've redesigned this page to group more key information together in one place.
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GRC Student Receives 2011 Julian David Baumert PhD Thesis Award
The thesis of Dr. Andrew Ying, GRC student, receives the 2011 Julian David Baumert PhD Thesis Award for the best thesis at NSLS.
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FCRP Professor Receives 2011 IEEE Pioneer Award in Nanotechnology
FENA Prof. Balandin is selected for Pioneer Award in Nanotechnology for 2011
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CADTS Featured Publication
Lowest experimentally demonstrated energy efficiency of sub-8 fJ/b/mm for on-chip wires shown on 65 nm chip.
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CADTS Featured Publication
Post-silicon tuning method to compensate for variation improves delay yield by average of 40%.
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ICSS Featured Publication
3D processor-memory system thermal analysis shows temperature can increase by up to 15°C over 2D design.
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