IEEE Electronics Components and Technology Conference Contributions from the SRC Community

Posted: 28-May-2021

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In addition to the SRC researchers featured below, SRC community members are involved with ECTC in several other ways. Sam Naffziger (AMD) is giving a keynote talk on week 1 “What the Chiplet-Based Future of Compute Means for Components and Technology”. Vanessa Smet (Georgia Tech) is on the “Materials and Technologies for advanced Packaging (5G, RF, Power, Harsh Environment)” panel. Claudio Alvarez (Georgia Tech) received the IEEE ECTC Student Travel Award.

Paper #2.7 Reliability Considerations for Wafer Scale Systems Niloofar Shakoorzadeh Chase, (UCLA), Randall Irwin (UCLA), Yu-Tao Yang (UCLA), Haoxiang Ren (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.024
Paper #4.5 Novel High-power Delivery Architecture for Heterogeneous Integration Systems Kannan Kalappurakal Thankappan (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.024
Paper #11.7 Compression Bonding in Heterogenous Wafer-scale Systems Krutikesh Sahoo (UCLA), Saptadeep Pal (UCLA), Niloofar Shakoorzadeh Chase (UCLA), Yu-Tao Yang (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.024
Paper #12.3 Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems Randall Irwin (UCLA), Krutikesh Sahoo (UCLA), Saptadeep Pal (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.025
Paper #19.1 Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment Rui Chen (Georgia Tech), Nicholas Ginga (Georgia Tech), Suresh Sitaraman (Georgia Tech) SRC PKG Task 2952.001
Paper #22.2 Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-Year Pradeep Lall (Auburn University), Yunli Zhang (Auburn University), Madhu Kasturi (Auburn University), Padmanaya Choudhury (Auburn University), Haotian Wu (Auburn University), Jeff Suhling (Auburn University), Ed Davis (Auburn University) SRC PKG Task 2876.001
Paper #26.2 Mantennas in Glass Interposer for sub-THz Applications Kai-Qi Huang (Georgia Tech), Madhavan Swaminathan (Georgia Tech) SRC JUMP Task 2776.034; 2776.036
Paper #29.2 Demonstration of a High-Inductance, High-Density, and Low DC Resistance Compact Embedded Toroidal Inductor for IVR Claudio Alvarez (Georgia Tech), Prahalad Murali (Georgia Tech), Madhavan Swaminathan (Georgia Tech) SRC JUMP Task 2776.033
Paper #34.3 Flexible Heterogeneously Integrated Low Form Factor Wireless Multi-channel Surface Electromyography (sEMG) Device Arsalan Alam (UCLA), Michael Molter (UCLA), Ayusha Kapoor (UCLA), Bilwaj Gaonkar (UCLA), Samatha Benedict (UCLA), Luke Macyszyn (UCLA), Michael Joseph (CalState, Northridge), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.025
Paper #35.1 Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications Yu-Tao Yang (UCLA), Chaowei Hu (UCLA), Niloofar Shakoorzadeh (UCLA), Haoxiang Ren (UCLA), Ni Ni (UCLA), Kang L. Wang (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.024
Paper #36.1 Fabrication of Flexible Ionic-Liquid Thin Film Battery Matrix on FlexTrateTM for Powering Wearable Devices Guangqi Ouyang (UCLA), Grace Whang (UCLA), Emily McInnis (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.034; 2776.036
Paper #46.2 A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils Guangqi Ouyang (UCLA), Goutham Ezhilarasu (UCLA), Henry Sun (UCLA), Haoxiang Ren (UCLA), Yu-Tao Yang (UCLA), Subramanian S. Iyer (UCLA) SRC JUMP Task 2776.025
Paper #46.11 Characterization of Chip-to-Package Interconnects for Glass Panel Embedding (GPE) for Sub-THz Wireless Communications Siddharth Ravichandran (Georgia Tech), Xiaofan Jia (Georgia Tech), Madhavan Swaminathan (Georgia Tech), Serhat Erdogan (Georgia Tech) SRC JUMP Task 2776.025