Nominations are now open
MAPT Roadmap 2.0 Nominations Open
Nominations are now open for the technical working groups (TWGs) for the Microelectronics and Advanced Packaging Roadmap (MAPT) - an industry-wide initiative of major impact on the semiconductor and ICT industry. The 1st edition of the MAPT Roadmap, released in October 2023, has gained significant traction. The roadmap is updated on a 2-year cadence, and the roadmapping activity for MAPT 2.0 has now begun in earnest, aiming for the 2nd Edition by October 2025.
If you are interested in joining the coalition to learn and network with other experts, shape and define the Roadmap’s agenda, and dedicate expertise and future perspective, please self-nominate here:
https://src.secure-platform.com/a/solicitations/363/home
The application process uses OpenWater and requires a valid SRC.org website account. Find help here.
The nomination window will close on Wed, September 18th, so that the initial working groups can be formalized and get to work. Please note that each organization can delegate up to 4 participants to TWGs exclusive of the working group's leadership.
Technical Working Groups
We welcome your (or your organization’s involvement) in our 12 critical working groups:
- TWG 1: Application Drivers & System Requirements
- TWG 2: Sustainability and Energy Efficiency
- TWG 3: Security and Privacy
- TWG 4: Digital Processing
- TWG 5: Analog and Mixed-Signal Semiconductors
- TWG 6: Photonics & MEMS
- TWG 7: Advanced Packaging & Heterogeneous Integration
- TWG 8: Materials, Substrates, and Supply Chain
- TWG 9: Design, Modeling, Test, and Standards
- TWG 10: Manufacturing and Process Development Metrology
- TWG 11: Workforce Development
- TWG 12: Digital Twins
MAPT Roadmap 1.0
The SIA-SRC 2030 Decadal Plan for Semiconductors has been hailed for clearly outlining the 5 critical grand challenges that the semiconductor industry must solve this decade to drive hardware advances that usher in the next industrial revolution. This is the "WHAT" that must be solved in hardware to deliver on the promise of smarter cars, edge intelligence, VR, general purpose AI, and 6G+.
As the next logical step in this journey, the SRC-led coalition of 112 organizations developed the Microelectronics and Advanced Packaging Technologies Roadmap 1.0 last year. The goal is simple – to collaborate with all parts of the semiconductor ecosystem to develop a concrete plan that will deliver on the Decadal Plan. Think of this as the "HOW" that complements the "WHAT" above. It is driven by both chipmaking and heterogeneous integration, R&D, and workforce development. Of course, this effort is also working to inform and intercept the CHIPS ACT.
