Overview

The application drivers for Packaging technologies have evolved significantly as computing devices continue to evolve along a few emerging market vectors:

• Small, flexible, light, easy-to-use interconnected consumer devices continue to be broadly accepted
• Cloud based computing, that requires high compute density in Data centers and Servers, continues to become increasingly important
• Embedded computing that offers greater degree of control in various applications (automotive, commercial and space) grows in scope

In addition, 'green' high performance computing, ergonomic and form factor-challenged mobile applications, new wearable devices & IoT (Internet of Things) applications, and extreme operating environment applications, are all driving new and unique packaging research needs.

The tasks in this research program are divided into two groups; those in a Center and those as individual tasks. The center has been established to address issues directly related to heterogeneous integration of microchips:

CHIRP, Center for Heterogeneous Integration Research on Packaging.

Research Focus

The Packaging thrust focuses on research that addresses emerging application needs for packaging in these areas:

• Heterogeneous component integration
• Global interconnects, including optical
• Power delivery
• Thermal Management
• Metrology and modeling
• Reliability including electromigration
• Flexible packages
• Low-cost packages
• Packaging for automotive and extreme environments
• Solders and ball grid arrays