John Oakley, Program Manager

Focusing on advanced packaging solutions for high performance computing, Internet of Things,
and extreme environment applications.

Upcoming Events

Date Event Summary
3–7 June 2024
Combined ESH/PKG Annual Review
Monday, June 3, 2024 — Friday, June 7, 2024
Chandler, AZ, United States

Past Events

Date Event Summary
11–13 July 2023
Packaging / CHIRP Annual Review (West Lafayette, IN)
Tuesday, July 11, 2023, 8 a.m. — Thursday, July 13, 2023, 5 p.m. ET
West Lafayette, IN, United States

4 May 2023
Fundamentals of Low-temperature Cu-Cu Hybrid Bonds Using Cu (111) Surfaces
Thursday, May 4, 2023, 8 p.m.–9 p.m. ET
Durham, NC, United States


4819 Emperor Blvd, Suite 300 Durham, NC 27703 Voice: (919) 941-9400 Fax: (919) 941-9450

Important Information for the SRC website. This site uses cookies to store information on your computer. By continuing to use our site, you consent to our cookies. If you are not happy with the use of these cookies, please review our Cookie Policy to learn how they can be disabled. By disabling cookies, some features of the site will not work.