NEW materials for LogIc, Memory and InTerconnectS (NEWLIMITS)
The NEW LIMITS Center has a vertically integrated mission to develop synthesis, integration, and evaluation schemes for new materials that will be applied in unique logic, memory, and interconnect applications to enable novel computing and storage paradigms beyond the capabilities of conventional CMOS.
Spintronic Materials for Advanced Information Technologies (SMART)
The SMART Center mission accelerates the development of beyond-CMOS building blocks with advanced spintronic materials and devices to create new pathways for exponential scaling across multiple generations.
Innovative Materials and Processes for Accelerated Compute Technologies (IMPACT)
The IMPACT Center is based on computational modeling and synergistic experimentation. Interconnect research will range from materials implementable in the medium term to materials exhibiting novel carrier transport physics such as liner-free, oxide- and non-oxide-based topological metals.
Upcoming Center Annual Virtual Reviews in 2021
IMPACT Center Annual Review
— May 25 - 27 via WebEx
NEWLIMITS Center Annual Review
— June 29 - July 1
SMART Center Annual Review
— August 3 - 5
Current39 Research Tasks13 Universities157 Students33 Faculty Researchers128 Liaison Personnel
This Year14 Task Starts60 Research Publications9 Patent Applications
Last Year1 Contract Starts13 Task Starts375 Research Publications10 Patent Applications
Since Inception24 Contracts85 Research Tasks30 Universities228 Students91 Faculty Researchers184 Liaison Personnel984 Research Publications29 Patent Applications