NEW materials for LogIc, Memory and InTerconnectS (NEWLIMITS)

The NEW LIMITS Center has a vertically integrated mission to develop synthesis, integration, and evaluation schemes for new materials that will be applied in unique logic, memory, and interconnect applications to enable novel computing and storage paradigms beyond the capabilities of conventional CMOS.

Spintronic Materials for Advanced Information Technologies (SMART)

The SMART Center mission accelerates the development of beyond-CMOS building blocks with advanced spintronic materials and devices to create new pathways for exponential scaling across multiple generations.

Innovative Materials and Processes for Accelerated Compute Technologies (IMPACT)

The IMPACT Center is based on computational modeling and synergistic experimentation. Interconnect research will range from materials implementable in the medium term to materials exhibiting novel carrier transport physics such as liner-free, oxide- and non-oxide-based topological metals.