NEW materials for LogIc, Memory and InTerconnectS (NEWLIMITS)
The NEW LIMITS Center has a vertically integrated mission to develop synthesis, integration, and evaluation schemes for new materials that will be applied in unique logic, memory, and interconnect applications to enable novel computing and storage paradigms beyond the capabilities of conventional CMOS.
Spintronic Materials for Advanced Information Technologies (SMART)
The SMART Center mission accelerates the development of beyond-CMOS building blocks with advanced spintronic materials and devices to create new pathways for exponential scaling across multiple generations.
Innovative Materials and Processes for Accelerated Compute Technologies (IMPACT)
The IMPACT Center is based on computational modeling and synergistic experimentation. Interconnect research will range from materials implementable in the medium term to materials exhibiting novel carrier transport physics such as liner-free, oxide- and non-oxide-based topological metals.
Current36 Research Tasks13 Universities92 Students33 Faculty Researchers132 Liaison Personnel
This Year2 Research Publications
Last Year14 Task Starts225 Research Publications16 Patent Applications1 Patents Granted
Since Inception24 Contracts85 Research Tasks30 Universities241 Students91 Faculty Researchers195 Liaison Personnel1,151 Research Publications36 Patent Applications1 Patents Granted