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1 through 7 of 7 similar documents, best matches first.   
1: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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2: Temperature Sensor Array and Micro-Heater Thermal Calibration...
Temperature Sensor Array and Micro-Heater Thermal Calibration Application Type: Utility Country: United States Status: Filed on 23-Sep-2022, Published by Patent Office ...
URL: https://www.src.org/library/patent/p2082/
Modified: 2022-09-23 - 24KB
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3: Composite Thermal Interface Material Including Particles and...
Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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4: Thin Epitaxial Carbide Wafer Fabrication (Patent P1435) - SRC
Thin Epitaxial Carbide Wafer Fabrication Application Type: Utility Patent Number: 9761493 Country: United States Status: Filed on 24-Jan-2014, Issued on 12-Sep-2017 Organization: ...
URL: https://www.src.org/library/patent/p1435/
Modified: 2017-09-12 - 22KB
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5: Oriented Crystal Nanowire Interconnects (Patent P1479) - SRC
Oriented Crystal Nanowire Interconnects Application Type: Utility Patent Number: 9117821 Country: United States Status: Filed on 11-Mar-2014, Issued on 25-Aug-2015, Patent ...
URL: https://www.src.org/library/patent/p1479/
Modified: 2015-08-25 - 23KB
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6: On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip...
On-Chip Radio Frequency (RF) Interconnects for Network-On-Chip Designs Application Type: Utility Patent Number: 8270316 Country: United States Status: Filed on 30-Jan-2009, Issued ...
URL: https://www.src.org/library/patent/p1123/
Modified: 2012-09-18 - 23KB
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7: Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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1 through 7 of 7 similar documents, best matches first.