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- 1:
Passivated Copper Conductive Layers for Microelectric Applications...
- Passivated Copper Conductive Layers for Microelectric Applications Application Type: Divisional Patent Number: 6057223 Country: United States Status: Filed on 10-Feb-1998, Issued ...
URL: https://www.src.org/library/patent/p0048/
Modified: 2000-05-02 - 22KB
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- 2:
Oxidation Resistant High Conductivity Copper Layers For Microelectroni...
- Oxidation Resistant High Conductivity Copper Layers For Microelectronic Applications and Process of Making Same Application Type: Divisional Patent Number: 5959358 Country: United ...
URL: https://www.src.org/library/patent/p0054/
Modified: 1999-09-28 - 24KB
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- 3:
Passivated Copper Conductive Layers for Microelectronic Applications...
- Passivated Copper Conductive Layers for Microelectronic Applications and Methods of Manufacturing Same Application Type: Utility Patent Number: 5766379 Country: United States ...
URL: https://www.src.org/library/patent/p0015/
Modified: 1998-06-16 - 24KB
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