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IPS – Interconnect & Packaging Sciences
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Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
- Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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