Call for White Papers in Emerging Technologies in Materials, Processes, and Devices
Overview
Semiconductor Research Corp. (SRC) Global Research Collaboration (GRC) is soliciting White Papers in the areas of novel materials and processes, devices (digital, analog, and memories), interconnect, and packaging. The principal goals of this program are to understand and overcome scientific and technical barriers to extend integrated-circuit scaling in terms of performance, density, and functionality. The motivation of this call is to target longer-term research for GRC. Specifically, the research activities should provide solutions that our members will need in 7–10 years for internal evaluation. These should correspond to the technologies that are listed near the end of the Roadmap (International Technology Roadmap for Semiconductors) which projects the leading technologies in production in the next 15 years.
This call, issued to universities worldwide, may be addressed by an individual investigator or a research team. Our selection process is divided into two stages. Interested parties should submit 1-page White Papers describing the proposed research. Investigators or co-investigators may participate in no more than three submissions. Selected White Papers will result in invitations to submit full proposals. A limited number of these proposals will be selected for 3-year research projects. The number and sizes of the contracts awarded will be determined by the amount of available funds and the number of high-quality proposals. The anticipated funding level per project is expected to be in the range of $80K to $120K per year, which includes the overhead expenses charged by the institution. The amount of funding requested will be a factor in the selection process. Proposals that include university/government matching funds are strongly encouraged.
A simultaneous solicitation in Design and Tools for Future Systems and Technologies is being conducted: see /compete/s201214/.
Research Scope
Specific research topics of interest are listed below but proposals with unique quality and insight on related topics will also be considered.
| 1. Emerging Device Technologies | |||
|---|---|---|---|
| 1.1 | Logic device studies on TFET, FETs on nanowire, CNT, and graphene, and other emerging logic devices | ||
| 1.2 | MOSFETs on alternate materials (III-V, Ge…) with efficient n- and p-channel with the same material system | ||
| 1.3 | Advanced analog devices for analog and mixed-signal circuits | ||
| 1.4 | Advanced RF power devices | ||
| 1.5 | Integrated passives and MEMS devices | ||
| 1.6 | Noise and isolation issues for SoC | ||
| 1.7 | Nonvolatile memories and selection devices | ||
| 1.8 | Devices for functional diversification (sensors, energy harvesting, MEMS...) | ||
| 1.9 | TCAD modeling for processes and devices | ||
| 1.10 | Compact modeling for emerging devices | ||
| 2. Enabling Materials and Processes for Future Devices, Interconnect, and Packaging | |||
|---|---|---|---|
| 2.1 | Exploring nanoscale physics and novel materials | ||
| 2.2 | Emerging materials for scaling/diversification (hybrid dielectrics, nanomagnetic composites, bioelectronics sensing, etc.) | ||
| 2.3 | Emerging patterning solutions as alternatives to dual damascene | ||
| 2.4 | Directed Self Assembly (DSA) of nanomaterials (etch-free pattern transfer) | ||
| 2.5 | Integrated photonic components for I/O's | ||
| 2.6 | On-chip energy sources (cathode/anode materials for on-chip batteries, thermoelectrics) and energy harvesting components | ||
| 2.7 | Advanced packaging solutions to address the integration of future analog and mixed-signal systems aimed at but not limited to intelligent sensor, control, and communication applications | ||
| 2.8 | Emerging interconnect solutions and materials beyond copper interconnects and conventional low-k dielectrics | ||
| 2.9 | Advanced heterogeneous "3D-IC cubes", possibly incorporating optical interconnectivity, solid-state cooling, etc. | ||
| 2.10 | Novel packaging solutions to address the ultimate limits of volume, power, frequency, and I/O bandwidth density | ||
| 2.11 | Emerging packaging materials and structures utilizing self-patterned organic materials, self-aligned nanostructures, embedded nanoparticles, etc. | ||
| 2.12 | Advanced metrology for measuring nanomaterial properties (stress, thermal conductivity, etc.) of ultra-thin films and interfaces | ||
White Paper Guidelines
White Papers are limited to one page in length, using a minimum of 10-point font size, and must be submitted via the SRC web-site. Submissions are due by Thursday, September 13, 2012, 3 PM EDT/12 PM PDT. Submissions not in compliance with all guidelines will be excluded from consideration.
Please include the following identifying information in your white paper:
- Project title
- Investigator(s)
- University
- Principal investigator's contacts (telephone number and e-mail address)
- Specific topic addressed from the above list (e.g. 1.4)
Please address the following in your white paper:
- Background: Emphasize area and problem to be addressed; match the most relevant topic addressed (Item #) in the list above; describe why research is being done; rationalize value in terms of semiconductor industry needs.
- Approach: Present your strategy for addressing the problem, including important findings from your research to date; state the role and novelty of this research in advancing knowledge and state-of-the-art; describe how you plan to interact with SRC member companies.
- Objective and Results: What do you plan to accomplish in a 3-year program; what is the anticipated output of a successful effort and benefit to SRC members?
- Funding Request and Participants: Provide a per-year approximation of overall funding requirements which should include overhead charges. Please indicate the number of students supported and their degrees pursued. Please also specify matching funds applicable to the proposed research, if any.
- Background IP - Identify any blocking pre-existing intellectual property on which new results will be based.
Awardees will be expected to:
- Participate in annual project review
- Interact with industry liaisons
- Submit reports for pre-defined deliverables
- Submit publications resulting from sponsored research
- Update information about participating students
Timetable and Deadlines
| Event | Date |
|---|---|
| Announcement for Call for White Papers | Thursday, August 9, 2012 |
| Deadline to submit white papers | Thursday, September 13, 2012 - 3 PM EDT/12 PM PDT |
| Invitation to submit full proposals | Friday, October 19, 2012 |
| Deadline to submit full proposals | Tuesday, November 20, 2012 - 3 PM EDT/12 PM PDT |
| Notification of final selection results | Wednesday, January 9, 2013 |
| Program/Funding Start | Friday, March 1, 2013 |
Please direct all technical questions to Dr. Kwok Ng, (kwok.ng@src.org, 919-941-9417). All other questions should be directed to Leslie Faiers (leslie.faiers@src.org, 919-941-9455).
