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    • • CADTS
      • ICSS
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    • CADTS
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      • Logic & Physical Design
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      • Analog and Mixed-Signal Devices
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    • IPS
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      • Back End Processes
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    • NMS
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      • Environment, Safety & Health
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    Thrusts
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    • 3D
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    • ESH
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    Centers
  • • • Advanced Devices (MIC, PID)
      • Advanced Devices & Technologies (MPS, CSR, MBP, DES, PID, MIC, NIS, ICSS, DS)
      • Advanced Technology (MIC, MBP, PID)
      • Alternative Device Structures (MIC, PID)
      • Analog and Mixed-Signal Devices (MPS, NIS, CSR, DS)
      • Analysis, Design & Simulation (PKG)
      • Back End Processes (MPS, INT, CSR, MBP, LIT, MFGPS, IPS, MIC, DS)
      • CFM & Total Chemical Management (INT, MFGPS, MBP, LIT)
      • Circuit Design (CSR, DES, PID, MIC, NIS, ICSS)
      • Compact Modeling (NIS, CSR, DS)
      • Contamination Control (ESH, MFGPS)
      • Controls and Sensing (FAC, MSS)
      • Defect Reduction (MBP)
      • Deposition (MFGPS, MBP)
      • Design Environment (DES)
      • Design Synthesis (DES)
      • Design Techniques (DES)
      • Design Verification (DES)
      • Device Sciences Modeling & Simulation (MPS, NIS, CSR, DS)
      • Digital CMOS Technologies (MPS, NIS, CSR, DS)
      • Doping Technologies (MIC, MFGPS, MBP, PID)
      • Environment, Safety & Health (MPS, ESH, MFGPS, NMS)
      • Equip. Auto. and Process Control (INT, FAC, MSS)
      • Equipment (INT, MFGPS)
      • Factory Automation & Management (INT, FAC, MSS)
      • Factory Operations (FAC, MSS)
      • Factory Systems (NMS, MPS, NIS, CSR, MBP, PID, MIC, FAC, MSS)
      • FEOL Processes (MIC, MFGPS, MBP, PID)
      • Front End Processes (MPS, DS)
      • Heat, Signal, & Power Distribution (PKG)
      • Integrated System Design (MIC, CSR, ICSS, DES, PID)
      • Lithography (LIT, MIC)
      • Logic & Physical Design (CSR, CADTS)
      • Logic Design (CADTS, DES)
      • Masks (LIT)
      • Materials (PKG, INT, MIC, MBP)
      • Materials & Measurements (PKG)
      • Memory Technologies (NIS, CSR, DS)
      • Metrology (PKG, LIT)
      • Metrology Tools, Matls & Processes (LIT)
      • Modeling & Simulation (SMS, INT, MBP, PID, LIT, MFGPS, MIC, MSS)
      • Modeling & TCAD (PKG, LIT)
      • Multi-level Interconnect (INT, MIC)
      • Nanoengineered Materials (CSR, NMS, DS)
      • Non-Classical CMOS Research (DS)
      • Package & Electrical Design (PKG)
      • Package Reliability (PKG)
      • Packaging (NIS, IPS, CSR)
      • Packaging & Interconnect Systems (PKG, NIS, CSR)
      • Packaging Materials and Metrology (PKG)
      • Packaging Materials Interfaces (PKG)
      • Packaging Modeling and Simulation (PKG)
      • Patterning (MPS, LIT, CSR, NMS)
      • Patterning Materials (LIT)
      • Patterning Systems (LIT)
      • Physical Design (NIS, CSR, CADTS, DES)
      • Plasma Etch (INT, MIC)
      • Process Architecture (MIC, PID)
      • Process Simplification/Enhancements (MIC, PID)
      • Processes (MIC, INT, MFGPS)
      • Quality & Reliability (MIC, INT, MFGPS, MBP, PKG)
      • Reliability (PKG, INT, MFGPS, MBP)
      • Resist (LIT)
      • Semiconductor Modeling & Simulation (MPS, SMS)
      • Substrates (PKG)
      • Synthesis & Verification (CADTS, DES)
      • TCAD-MBPS (MIC, MBP)
      • Technology CAD (MIC, MBP, DES, PID)
      • Test & Testability (CSR, CADTS, DES)
      • Thermal Management (PKG)
      • Verification (CSR, CADTS, DES)
    Historical Thrusts
    Note: This list shows each Thrust with every Science Area
    that has been associated with it in parentheses.
    Grayed items are historical.
• FCRP Focus Center Research Program
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  • All ERI Research
  • • Select all current centers
    • NPT
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    Centers

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