Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 22
Patent Filings 8
Other 1

SRC Program
SRC 18
GRC 13
3D EC 1
FCRP 1

Year
2015 2
2013 3
2012 2
2011 5
2010 10

Center
C2S2 12
FENA 12
GSRC 12
IFC 12
MSD 12
TxACE 7
MuSyC 6
C-FAR 4
CNFD 4
FAME 4
INDEX 4
LEAST 4
SONIC 4
SWAN 4
TerraSwarm 4
EBSM 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
LPD – Logic & Physical Design 6
CADT – Computer-Aided Design and... 5
TT – Test & Testability 5
AMS-CSD – Analog/Mixed-Signal Ci... 3
CD – Circuit Design 3
HWS – Hardware Security 3
ISD – Integrated System Design 3
SLD – System Level Design 3
VER – Verification 3
I3T – Innovative and Intelligent... 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

31 through 31 of 31 similar documents, best matches first.   
<< previous Page: 1 2 Results by:Thunderstone
31: pdfE003932 - Variability Forum - Nowka
Test Structures for Variability Characterization Kevin Nowka IBM Research - Austin nowka@us.ibm.com IBM Research Worldwide Watson Almaden Zurich Beijing Haifa Austin Tokyo Delhi ...
URL: https://www.src.org/calendar/e003932/e003932_s1_3_nowka.pdf
Modified: 2010-06-29 - 1.4MB
Find Similar Documents