[x]
Thrust/Theme
NEWLIMITS-T2 – 2D Materials Devices and Interconnect Technologies
[x]
Content Type
Patent Filings
|
| 1 through 1 of
1 similar documents, best matches first. |
|
- 1:
Converting Ta- and Ti-Based Cu Diffusion Barriers into their...
- Converting Ta- and Ti-Based Cu Diffusion Barriers into their sp2 Bond Based 2D Materials to Enhance Diffusion Barrier Properties with Atomically-thin Thickness Application Type: ...
URL: https://www.src.org/library/patent/p1824/
Modified: 2022-03-29 - 22KB
Find Similar Documents
|
|
