Questions?
[x] SRC Program
FCRP

[x] Center
IFC

Content Type
Patent Filings 5
Events 1
Other 1

Year
2012 1

1 through 7 of 7 similar documents, best matches first.   
1: Semiconductor Research Corporation - SRC
FCRP FCRP Focus Center Research Program (Legacy) Multi-Scale Systems Research Center Creation of a comprehensive and a systematic solution to the distributed multi-scale system ...
URL: https://www.src.org/program/fcrp/
Modified: 2023-10-10 - 32KB
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2: Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for...
Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for Hybrid CMOS/Nanodevice Circuits Application Type: Utility Patent Number: 7737726 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1119/
Modified: 2010-06-15 - 22KB
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3: Thermal Management Devices, Systems, and Methods (Patent P1044...
Thermal Management Devices, Systems, and Methods Application Type: Utility Patent Number: 7532467 Country: United States Status: Filed on 4-Oct-2007, Issued on 12-May-2009, Patent ...
URL: https://www.src.org/library/patent/p1044/
Modified: 2009-05-12 - 22KB
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4: 3-D ICs Equipped with Double Sided Power, Coolant, and Date Features...
3-D ICs Equipped with Double Sided Power, Coolant, and Date Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1143/
Modified: 2013-10-01 - 23KB
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5: 3-D ICs Equipped with Double Sided Power, Coolant, and Data Features...
3-D ICs Equipped with Double Sided Power, Coolant, and Data Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1419/
Modified: 2014-10-01 - 23KB
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6: Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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7: pdfMicrosoft Word - final-fcrp-3d-2012.docx
Semicondu Cross-Cent 3D Inte 2nd E-Wo March 9, Organizer 1. Introdu 12:00 - 12 2. Cooling 12:15 - 12 12:40 - 1: 1:00 - 1:0 3. Archite 1:05 - 1:2 1:25 - 1:4 1:45 - 2:0 2:05 - 2:1 4. ...
URL: https://www.src.org/calendar/e004681/agenda.pdf
Modified: 2012-03-26 - 102KB
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1 through 7 of 7 similar documents, best matches first.